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HP2-T16 - Industry Standard Architecture and Technology - BrainDump Information

Vendor Name : HP
Exam Code : HP2-T16
Exam Name : Industry Standard Architecture and Technology
Questions and Answers : 158 Q & A
Updated On : February 15, 2019
PDF Download Mirror : HP2-T16 Braindumps
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HP2-T16 exam Dumps Source : Industry Standard Architecture and Technology

Test Code : HP2-T16
Test Name : Industry Standard Architecture and Technology
Vendor Name : HP
Q&A : 158 Real Questions

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HP Industry Standard Architecture and

what is Intel’s Foveros tech and what isn’t it? | killexams.com Real Questions and Pass4sure dumps

Intel Logoone of the vital unique technologies proven in 2018 was Intel’s Foveros chip stacking. it may well not were the holy grail of semiconductors however ranks as at least an anointed stein.

Lets be clear about this, Foveros is whatever between a extremely advanced iteration of what become and a big step toward the conclusion intention of arbitrary chip stacking however doesn’t somewhat make it all the method. That stated it's a extremely cool element to be able to have some very enjoyable functions beyond what became shown off at Intel’s architecture Day. To explain what Foveros is and what it isn’t, lets seem at the details.

Intel Foveros demo board

The demo of Foveros

What you see above is the primary public displaying of Lakefield, the primary product in line with Foveros expertise. it's a big.Little system with four ‘small’ Atom cores and one ‘massive’ mainstream Ice Lake-ish core. Intel mentioned it was designed for a selected client and is derived in a 12x12mm package. For those of you no longer up on packaging minutia, it really is the standard dimensions for cell/pill SoCs. (note: consider free to insert your personal shaggy dog story about Intel’s commentary on ARM’s big.Little and the way they would by no means need to do it themselves, it is just too easy for us authorities. we would get no facets since the complexity multiplier is zero.)

Foveros with Active Interposers

Foveros with active Interposers

the first diagram of Foveros that Intel showed off was a CPU and radio established on an active interposer. here is fairly ordinary stuff, nothing new right here or at least nothing new printed yet but we might be surprised if there were now not hidden twists yet to come. Why aren’t we excited? as a result of IBM showed off an even bigger and warmer die version almost seven years in the past at usual Platform 2012. AMD, Xilinx, and dozens of others had been transport products on passive interposers too, it's historical hat through now. So what is new? Take a glance on the diagram below.

Foveros die on die

Foveros die on die

the first diagram become simply an lively interposer but this one has two active dies installed nose to nose. until you count the a whole bunch of tens of millions of cell phones available, this one is unique. truly we would trust Foveros to be wonderful in this circumstance for one motive, vigor. not like cellular phone chip stacks which prevent the biggest difficulty of chip stacking, heat, Foveros doesn’t. form of.

heat is the issue with stacking and the aforementioned holy grail is to arbitrarily stack sizzling dies on scorching dies without the issues of bump cracking, issues melting, and vigor distribution headaches. cellphones which run within the low single digit watt range stay away from this by using no longer the usage of ample vigor for it to be a big difficulty. With hot/scorching dies you deserve to pull that heat out from the bottom layer and silicon is a pretty good insulator so up is not a fine solution to do it. in the intervening time on the grounds that there had been no actual scorching/hot die stacks shown by means of any one, it appears like the options aren’t obtrusive or near term.

Coming again to Foveros we now have the center floor which is why we known as it an anointed stein, it is a hot die on exact of a groovy die. this is anything SemiAccurate has no longer viewed any individual else publicly demonstrate earlier than, it's relatively interesting. which you could analyze this as fending off the problem or doing a little clever engineering to get us part of the way there, SemiAccurate thinks it's the latter. Intel certainly avoids the heat era on the lower die by means of putting the Atom cores there, however the properly die is still sizzling and there are lots of complications that even that brings.

The greatest of these issues is power distribution, hot dies without doubt eat extra power to do their job so how do you get it to the exact die? The glaring answers take a huge volume of die area so novel tactics are obligatory. That stated, Lakefield is a product and should most likely be transport so that you can anticipate Intel solved these issues.

Lakefield Foveros

Lakefield Foveros

in case you look on the Lakefield diagram you could study just a few unique issues into it. One is that Foveros is a 2-excessive stack, head to head, technology no longer a multi-die stack ala HBM reminiscence which at the moment goes to eight-excessive with TSVs as a substitute of head to head. With the caveat of, “this is just an illustrative diagram, now not a technical one” that you would be able to also see that the reminiscence is linked to the equipment, now not the precise chip as one would predict. This capacity you don’t should put loads of TSVs through your excessive price 10nm die sucking up loads of enviornment. in this sense Foveros is a lot more frequent construction.

Foveros on an FPGA

Foveros on an FPGA

probably the most entertaining element in regards to the technology is the flexibleness it permits. This goes past the standard mix and fit procedure tech that regularly occurring packaging technologies and chiplets like AMD’s Rome allows for for. Foveros will permit things like inserting blocks of functionality, be that memory, I/O, or whatever thing, near the elements of the chip that eat or produce records for it. The trick with Foveros is that these blocks may also be in the Z dimension, not X/Y, and might be on a unique die, system, and power rail. As that you can see above, Altera sees this as placing memory and storage closer to the blocks that use it. From that essential conception you could run wild as soon as stacking comes in to play for true.

So Foveros is the true deal however no longer the conclusion purpose. it is the first big step towards the intention of arbitrary hot/hot die stacking we have seen in years, the remaining one being IBM’s active interposer shown within the early part of this decade. except the next big step, Foveros feels like it's going to supply Intel some true advantages in each packaging and flexibility however as always the satan, and the capabilities, are within the as yet undisclosed details.

That observed SemiAccurate can shed a bit of light on two questions, who is it for and how Intel is fixing the power distribution complications.

observe: the following is for professional and student stage subscribers.

Disclosures: Charlie Demerjian and Stone Arch Networking functions, Inc. don't have any consulting relationships, investment relationships, or hang any funding positions with any of the businesses mentioned during this record.

right here two tabs alternate content material beneath. Charlie Demerjian is the founding father of Stone Arch Networking features and SemiAccurate.com. SemiAccurate.com is a know-how information website; addressing hardware design, software choice, customization, securing and maintenance, with over 1000000 views per month. he's a technologist and analyst that specialize in semiconductors, gadget and community architecture. As head creator of SemiAccurate.com, he regularly advises writers, analysts, and business executives on technical matters and lengthy lead trade trends. Charlie is additionally a council member with Gerson Lehman community. FullyAccurate newest posts via Charlie Demerjian (see all)

HP Launches FlexNetwork structure | killexams.com Real Questions and Pass4sure dumps

WEBINAR:On-Demand

EUC with HCI: Why It concerns

constructing a contemporary community isn't almost switches and routers anymore. The contemporary community is ready having an structure constructed for convergence, virtualization and the cloud. HP nowadays took the wraps off its new, modern network architecture dubbed FlexNetwork. the brand new structure comprises an evolution of the HP ProCurve networking heritage alongside new edition of apparatus with roots in 3Com. HP obtained 3Com in 2010 for $2.7 billion.

Kash Shaikh, Director of advertising, HP Networking, informed InternetNews.com that as a part of the FlexNetworking rollout, HP is saying the A10500, a new core swap evolved from the former 3Com product lineup. The A10500 provides as much as 2.fifty six Tbps of capability in one chassis. HP has plans to make the A10500 attainable with a 48 port, 10 GbE line card. The 48 port card will allow HP to convey 384 line rate ports.

"The efficiency is a combination of potential and latency," Shaikh stated. "From a consumer's factor of view the numbers are related."

Shaikh brought that as HP is expanding the performance, the latency continues to be the identical. HP is additionally scaling the A10500 with a forty GbE line price card it's being validated at the Interop conference in Las Vegas this week.

when it comes to scalability, Shaikh noted that the new A10500 switch can also be clustered enabling a knowledge core to manipulate distinctive switches as one. In complete, the clustered potential of the A10500 might allow the switch to scale to as much as 1,500 ports.

HP emphasizes necessities with FlexNetwork

Shaikh wired that HP's FlexNetwork architecture is all about embracing business necessities. He delivered that the structure might be aiding the TRILL commonplace as a alternative for spanning tree. Rival dealer Cisco has its own implementation of TRILL referred to as FabricPath.

Shaikh additionally took intention at Juniper network's Qfabric which is another strategy to flatten network architectures. He talked about Qfabric as a proprietary expertise that would cause supplier lock-in. Juniper announced Qfabric earlier this 12 months.

security features in FlexNetwork

protection is additionally a key part of HP's architecture. Michael Callahan Director, worldwide safety Product and solution advertising and marketing for HP Networking told InternetNews.com that the new HP TippingPoint 6100N IPS gives 60 p.c greater efficiency than prior types of the same platform.

Callahan introduced that each and every 6100N can check out eight Gbps of traffic and may be clustered in a pair to inspect up to 16 Gbps of traffic.

performance by myself isn't what differentiates the new IPS. Callahan stated that the 6100N additionally benefits from TippingPoint's DVlabs and its associated Zero Day Initiative (ZDI). ZDI will pay security researchers for vulnerabilities and then discloses the information to the affected vendor. HP does not publicly divulge the vulnerability inside of one hundred eighty days, unless the seller patches the flaw first. in the meantime, HP IPS customers get 180 of safety lead time that different IPS providers cannot deliver. additionally, Callahan noted that the 6100N could be used as a web utility Firewall (WAF), as a result of its application vulnerability potential base.

Rounding out HP's new solutions is an greater management equipment referred to as clever management center (IMC). that permits IT managers to have a "single pane of glass" view.

"IMC is enjoyable in that it offers administration throughout the entire building blocks of FlexNetwork and allows for the IT supervisor to handle all the instruments which are on the network," Shaikh mentioned.

Sean Michael Kerner is a senior editor at InternetNews.com, the information provider of information superhighway.com, the community for expertise professionals.


Microsoft and HP improve the trade’s First Dynamic records core Prototype below the Dynamic programs Initiative | killexams.com Real Questions and Pass4sure dumps

NEW ORLEANS, may additionally 6, 2003 — In his keynote handle today at the 12th annual home windows® Hardware Engineering conference (WinHEC), invoice Gates, chairman and chief software architect at Microsoft Corp., will exhibit an idea of a Dynamic records middle (DDC) collectively developed with HP. This DDC aspects a mix of HP servers, utility, storage and networking hardware related in line with a prescribed network structure. Microsoft®application dynamically assigns, provisions and centrally manages the DDC components. The software driving the DDC will allow valued clientele to automatically deploy a distributed application; provision the associated server, storage and networking supplies required for that application; and dynamically allocate substances to grow and shrink in response to business and workload calls for. The concept is a major milestone in Microsoft’s Dynamic programs Initiative (DSI) and represents the businesses’ lengthy-term collaboration to enable customers to harness the vigor of trade-typical hardware, maximize the price of their suggestions technology methods, and obtain new ranges of simplicity and automation.

“The application architecture underlying the Dynamic statistics center is a crucial innovation that can vastly simplify IT operations while helping purchasers use excessive-volume, not pricey, industry-normal hardware greater conveniently,”pointed out Jim Allchin, neighborhood vp of the systems Division at Microsoft.“bigger workloads can get extra elements on the fly, and smaller ones best consume the resources they want. we are dedicated to main the charge on the Dynamic methods Initiative, and we’re very happy to have industry-main vendors like HP alongside us to assist convey integrated hardware and application solutions aiding this effort.”

Shane Robison, government vice president and chief method and technology officer at HP, echoed the sentiment:“this is a thrilling day for us — and for the business usual — as the Dynamic statistics middle is a key step ahead for the Dynamic programs Initiative. we're very completely happy with the joint efforts that have taken place with Microsoft, and we seem forward to continuing this collaboration well into the long run.”

Collaboration to Create the primary Dynamic statistics core

This idea Dynamic records center from Microsoft and HP is the outcomes of greater than a 12 months of collaborative efforts between the two groups in support of the DSI and the underlying system Definition model (SDM). The SDM, a primary building block of the DSI structure, is a are living, Extensible Markup Language (XML) blueprint that provides a typical utility contract between construction, deployment and operations.

collaborating across the SDM, both Microsoft and HP contributed innovations right through the DDC development process. The windows Server (TM) group at Microsoft first developed a prototype of a future edition of computerized Deployment features (ads) — a magnificent server provisioning and administration tool for windows Server 2003 — extending its assist for the SDM. This future edition of ads will permit centralized provisioning and management of a prescribed set of industry-commonplace servers, storage and networking hardware.

HP contributed improvements in hardware, including prototypical development of an Authenticated identification for its ProLiant servers to greater increase server boot protection. HP additionally developed prototype SDM-enabled software providers, which allow Microsoft’s software to provision and manage HP ProLiant Servers, HP ProCurve switches and HP StorageWorks disk arrays. Microsoft additionally collaborates with HP due partly to HP’s competencies in datacenter innovation.

Broader Collaboration in aid of the Dynamic methods Initiative

Joint development around the Dynamic information center is just one side of a lots broader collaboration effort between Microsoft and HP in guide of the Dynamic techniques Initiative. HP’s combination of administration software, features, storage and server assets will allow it to deliver an entire set of DSI-compliant options together with these:

  • integrated software and hardware DDC options through HP’s manufacturing facility Integration capabilities and world capabilities

  • powerful new administration solutions for the Dynamic data center that leverage the SDM

  • Integration of adverts for the provisioning of home windows Servers within HP’s Utility information center providing now, and of Dynamic data middle methods sooner or later

  • in regards to the Dynamic systems Initiative

    The Dynamic systems Initiative is a huge Microsoft and trade effort that unifies hardware, application and service providers around a brand new application structure a good way to permit customers to harness the vigour of business-average hardware and should dramatically simplify and automate how shoppers construct, installation and function extremely scalable applications. Core to this new architecture is the system Definition model, a are living XML blueprint that provides a typical application contract between building, deployment and operations. The SDM may be supported by using application building tools, working techniques, server purposes, administration options and business-average hardware, resulting in a new technology of dynamic techniques.

    About windows Server 2003

    windows Server 2003 is a complete, built-in and at ease infrastructure designed to support shoppers in the reduction of fees and increase the effectivity and effectiveness of suggestions expertise (IT) operations. building on home windows 2000 family unit strengths, the new server platform helps purchasers extend current resources while laying the groundwork for building a brand new generation of related functions that enrich company productiveness. home windows Server 2003 is the basis for the Microsoft home windows Server system (TM) integrated server infrastructure, designed for constructing, deploying and operating agile company options.

    About Microsoft

    established in 1975, Microsoft (Nasdaq“MSFT”) is the international chief in utility, features and web technologies for personal and company computing. The enterprise offers a big range of items and services designed to empower individuals via first-rate utility — any time, anyplace and on any gadget.

    Microsoft, home windows, home windows Server and home windows Server system are either registered emblems or logos of Microsoft Corp. within the united states and/or different international locations.

    The names of precise companies and items mentioned herein could be the logos of their respective homeowners.

    be aware to editors: in case you have an interest in viewing additional information on Microsoft, please consult with the Microsoft web page at http://www.microsoft.com/presspass/ on Microsoft’s company information pages. net hyperlinks, mobile numbers and titles had been correct at time of e-book, however may additionally in view that have modified. For additional tips, journalists and analysts may additionally contact Microsoft’s quick Response group or other acceptable contacts listed at http://www.microsoft.com/presspass/contactpr.asp .


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    What is Intel’s Foveros tech and what isn’t it? | killexams.com real questions and Pass4sure dumps

    Intel LogoOne of the most interesting technologies shown in 2018 was Intel’s Foveros chip stacking. It may not have been the holy grail of semiconductors but it ranks as at least an anointed stein.

    Lets be clear about this, Foveros is something between a very advanced iteration of what was and a big step toward the end goal of arbitrary chip stacking but it doesn’t quite make it all the way. That said it is a very cool thing that will have some very interesting applications beyond what was shown off at Intel’s Architecture Day. To explain what Foveros is and what it isn’t, lets look at the details.

    Intel Foveros demo board

    The demo of Foveros

    What you see above is the first public showing of Lakefield, the first product based on Foveros technology. It is a big.Little system with four ‘small’ Atom cores and one ‘big’ mainstream Ice Lake-ish core. Intel said it was designed for a specific customer and comes in a 12x12mm package. For those of you not up on packaging minutia, that is the standard dimensions for cell phone/tablet SoCs. (Note: Feel free to insert your own joke about Intel’s commentary on ARM’s big.Little and how they would never need to do it themselves, it is too easy for us professionals. We would get no points because the complexity multiplier is zero.)

    Foveros with Active Interposers

    Foveros with Active Interposers

    The first diagram of Foveros that Intel showed off was a CPU and radio mounted on an active interposer. This is pretty standard stuff, nothing new here or at least nothing new revealed yet but we would be surprised if there were not hidden twists yet to come. Why aren’t we excited? Because IBM showed off a much bigger and hotter die version almost seven years ago at Common Platform 2012. AMD, Xilinx, and dozens of others have been shipping products on passive interposers too, it is old hat by now. So what is new? Take a look at the diagram below.

    Foveros die on die

    Foveros die on die

    The first diagram was just an active interposer but this one has two active dies mounted face to face. Unless you count the hundreds of millions of cell phones out there, this one is unique. Actually we would consider Foveros to be unique in this situation for one reason, power. Unlike cell phone chip stacks which avoid the biggest problem of chip stacking, heat, Foveros doesn’t. Sort of.

    Heat is the problem with stacking and the aforementioned holy grail is to arbitrarily stack hot dies on hot dies without the problems of bump cracking, things melting, and power distribution headaches. Cell phones which run in the low single digit watt range avoid this by not using enough power for it to be a big problem. With hot/hot dies you need to pull that heat out from the bottom layer and silicon is a great insulator so up is not a great way to do it. At the moment since there have been no real hot/hot die stacks shown by anyone, it looks like the solutions aren’t obvious or near term.

    Coming back to Foveros we have the middle ground which is why we called it an anointed stein, it is a hot die on top of a cool die. This is something SemiAccurate has not seen anyone else publicly demonstrate before, it is pretty unique. You can look at this as avoiding the problem or doing some clever engineering to get us part of the way there, SemiAccurate thinks it is the latter. Intel obviously avoids the heat generation on the lower die by putting the Atom cores there, but the top die is still hot and there are a lot of problems that even that brings.

    The biggest of these problems is power distribution, hot dies obviously consume more energy to do their job so how do you get it to the top die? The obvious answers take a huge amount of die area so novel approaches are needed. That said, Lakefield is a product and will presumably be shipping so you can assume Intel solved these problems.

    Lakefield Foveros

    Lakefield Foveros

    If you look at the Lakefield diagram you can read a few interesting things into it. One is that Foveros is a 2-high stack, face to face, technology not a multi-die stack ala HBM memory which currently goes to 8-high with TSVs instead of face to face. With the caveat of, “this is just an illustrative diagram, not a technical one” you can also see that the memory is connected to the package, not the top chip as one would expect. This means you don’t have to put lots of TSVs through your high value 10nm die sucking up lots of area. In this sense Foveros is a lot more conventional construction.

    Foveros on an FPGA

    Foveros on an FPGA

    The most interesting thing about the technology is the flexibility it allows. This goes beyond the usual mix and match process tech that conventional packaging technologies and chiplets like AMD’s Rome allows for. Foveros will allow things like putting blocks of functionality, be that memory, I/O, or whatever, close to the parts of the chip that consume or produce data for it. The trick with Foveros is that those blocks can be in the Z dimension, not X/Y, and can be on a different die, process, and power rail. As you can see above, Altera sees this as putting memory and storage closer to the blocks that use it. From that simple concept you can run wild once stacking comes in to play for real.

    So Foveros is the real deal but not the end goal. It is the first big step toward the goal of arbitrary hot/hot die stacking we have seen in years, the last one being IBM’s active interposer shown in the early part of this decade. Until the next big step, Foveros looks like it will give Intel some real advantages in both packaging and flexibility but as always the devil, and the capabilities, are in the as yet undisclosed details.

    That said SemiAccurate can shed a bit of light on two questions, who is it for and how Intel is solving the power distribution headaches.

    Note: The following is for professional and student level subscribers.

    Disclosures: Charlie Demerjian and Stone Arch Networking Services, Inc. have no consulting relationships, investment relationships, or hold any investment positions with any of the companies mentioned in this report.

    The following two tabs change content below. Charlie Demerjian is the founder of Stone Arch Networking Services and SemiAccurate.com. SemiAccurate.com is a technology news site; addressing hardware design, software selection, customization, securing and maintenance, with over one million views per month. He is a technologist and analyst specializing in semiconductors, system and network architecture. As head writer of SemiAccurate.com, he regularly advises writers, analysts, and industry executives on technical matters and long lead industry trends. Charlie is also a council member with Gerson Lehman Group. FullyAccurate Latest posts by Charlie Demerjian (see all)


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