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SU0-211 - Huawei Cert Datacom Associate-Network(R) Technology and Device - BrainDump Information

Vendor Name : Huawei
Exam Code : SU0-211
Exam Name : Huawei Cert Datacom Associate-Network(R) Technology and Device
Questions and Answers : 865 Q & A
Updated On : November 16, 2018
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SU0-211 exam Dumps Source : Huawei Cert Datacom Associate-Network(R) Technology and Device

Test Code : SU0-211
Test Name : Huawei Cert Datacom Associate-Network(R) Technology and Device
Vendor Name : Huawei
Q&A : 865 Real Questions

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Huawei Huawei Cert Datacom Associate-Network(R)

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enterprise Announcement - promises 34.0A per blade in a 7.50mm pitch connector, stand up to temperatures of as much as +125°C. Molex included introduces the tremendous Sabre™ vigor Connector equipment for all high-current purposes, the place flexible wire-to-wire and wire-to-board configurations are required. offering 34.0A per blade and withstanding as much as +a hundred twenty five°C working temperatures (USCAR-2, level 3), super Sabre power connectors are equally well-suitable to automotive and commercial car purposes as they're to the appliance, scientific, datacom and industrial manage industries.

“Design engineers are faced with the challenge of featuring superior vigour necessities with much less PCB-footprint,” says Michael Bean, international product supervisor, industrial items division at Molex. “within this small envelope, available packaging alternatives were restrained. in addition, accessories inside these techniques ought to be reputable and able to face up to rugged and excessive-temperature environments. Utilising confirmed and legitimate Sabre Connector multi-beam technology, the super Sabre Connector gadget helps solve these issues, presenting 34.0A current per blade and withstanding +one hundred twenty five°C operating temperatures.”

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vGRID implements HPE Synergy | killexams.com Real Questions and Pass4sure dumps

Monday, 10 April 2017, 10:fifty seven amPress unlock: vGrid

Media release

10 April 2017

vGRID implements HPE Synergy, strikes to Datacom’s Kapua records Centre

Homegrown cloud infrastructure and applications solution vGRID is bolstering the performance of its platform thanks to investment within the latest hardware systems and a move into Datacom’s fault-tolerant Kapua facts Centre found in Hamilton.

vGRID, developed by LayerX, gives locally-developed and supported utility as a provider (SaaS) and Infrastructure as a service (IaaS) options tailored for the small to medium enterprise market. vGRID distinguishes itself with reputable unparalleled efficiency, self-provider control panel performance, and compliance with New Zealand data sovereignty laws.

according to Bruce Trevarthen, LayerX group CEO, the business is the first in New Zealand to introduce HPE (Hewlett Packard business) Synergy hardware to underpin its cloud carrier providing. “This comes in response to powerful demand and remarkable increase for the vGRID portfolio of on-demand solutions,” he says. “We’ve elevated via over 22 p.c during the past 12 months and, with a contemporary deal inked with distributor exeed, expect even improved numbers in the 12 months forward.”

HPE Synergy is the primary platform architected from the floor up as a composable infrastructure that reduces operational complexity for typical workloads and raises performance for a new breed of cloud purposes and capabilities. via a single user interface, HPE Synergy enables for the composition of compute, storage, and networking supplies into configurations optimised for certain purposes.

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“LayerX is taking the lead in New Zealand by way of implementing the industry’s first composable infrastructure and delivering new value and alternatives for his or her company through a hybrid infrastructure. HPE Synergy will help the vGRID platform carry the highest ranges of performance and reliability to local small and mid-size companies looking to speed up their business,” says Raj Thakur, accepted manager, data Centre & Hybrid Cloud group, South Pacific, Hewlett Packard commercial enterprise.

Trevarthen notes that HPE Synergy is brought on the returned of LayerX’s a success deployment of HPE 3PAR StoreServ Storage, which has underpinned its features considering the fact that the very first HPE 3PAR installing again in 2011. “here's exquisite because it is a Tier 1 all-flash storage array. There are not any longer any ‘spinning’ hard disks and what that has supposed for our clients is dramatically improved performance and far stronger reliability as the imply time to failure of flash exceeds that of traditional disk by means of a wide margin.”

it is the field of reliability and availability that Trevarthen says has resulted in the move, which commences on 10 April, from the latest datacentre found at Waikato Innovation Park to Datacom’s intention-constructed independently licensed Tier three+ facility in Te Rapa, Hamilton. “The growth of the vGRID platform means we should be in a position to scale all of a sudden with none have an impact on on reliability and performance for latest or new consumers. Kapua statistics Centre, with its independent certification and Datacom’s recognition for working excessive availability infrastructure, became recognized as the most excellent solution,” he explains.

The circulation is expected to be completed in November this yr; moreover the circulation into the new information centre, significantly sooner fibre connections are being added, Trevarthan adds.

Tier 3+ certification has been independently assessed against the TIA-942 average. This provides verification of several metrics, together with fault tolerance so there aren't any single elements of failure, fire and water coverage, and redundant cooling techniques. vGRID gives geo-resilience through its Auckland site located at Highbrook.

Hamilton is recognized for its geographic stability and offers redundant connectivity, with all the important community providers working fibre rings through the city. it's additionally a hub of high tech company undertaking.

Trevarthen says chronic investment in choicest-of-breed expertise and innovation has delivered vGRID’s growth up to now and as it seeks to speed up market penetration, it will comply with the equal formula. “We’re on a trajectory for growth and have set some giant desires for the subsequent four years. Coupled with the exeed distribution engagement, our refreshed HPE infrastructure and Datacom internet hosting arrangements; vGRID is placed perfectly to satisfy those aims,” he concludes.

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old Vs. New programs | killexams.com Real Questions and Pass4sure dumps

over the years, the semiconductor trade has witnessed a parade of packaging improvements, such as gadget-in-kit, semiconductor embedded in substrate, and fan-out wafer-stage packaging.

Two wonderful packaging improvements at the moment are being used in the technique of miniaturizing microchips and electronics. One is a new conception that mixes two tried-and-authentic applied sciences. The different is a many years-historic method it truly is getting used in new approaches.

retaining dust, humidity, air, even atmospheric drive far from electronics is what airtight packaging and sealing methods have executed well-nigh when you consider that the age of dinosaurs–for more than seventy five years, predating the transistor and the integrated circuit. The method of hermetic packaging and sealing puts an impenetrable layer round electronics that continues air (gas) and water vapor far from electronic ingredients, making them air- and water-tight, accordingly conserving them from corrosion and different environmental hazards.

New traits in hermetic packaging and sealing are now making quicker, lighter, and smaller electronics possible.

Any technology that helps cram in more add-ons without sacrificing services is also welcome to handset producers. one other technology entrance within the quest for more suitable miniaturization is the substrate-like printed circuit board, or SLP. It represents a cross between a flexible substrate and a inflexible board.

The SLP suggests up most effective in smartphones now, however may well be utilized in IoT gadgets and eventually AI purposes, augmented and digital fact devices, and cars. some of the massive advantages is the flexibleness of now not having to choose from a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs had been employed in assembling the iPhone eight fashions and the iPhone X, in keeping with Yole Développement, which describes the expertise as “a conflict of two worlds,” PCBs and substrates. SLP could prove to be an alternative to modified semi-additive strategies, also called mSAP, in keeping with Yole.

“superior substrates have to answer calls for on each the scaling and purposeful roadmaps,” writes Emilie Jolivet, a know-how and market analyst at Yole. “The transition from the subtractive to the mSAP method and from PCB to substrate-like PCB is beneath approach in high-conclusion smartphones, pushed by way of Apple and its iPhone eight/iPhone X. other excessive-end smartphone suppliers, such as Samsung and Huawei, are expected to join in the close future.”

SLP will need to deal with different applied sciences, namely equipment substrate vs. no substrate with fan-out structures, together with through-silicon by way of packaging vs. TSV-less packaging.

Yole forecasts the SLP market will enhance from $1.9 billion in 2016 to $2.24 billion by means of 2023.

“The 28 chosen PCB/substrate manufacturers are all believed to have mSAP know-how, and some of them can manufacture SLP,” mentioned Yole’s Vivienne Hsu. “driven through high-conclusion smartphone demand, definite avid gamers appear to have excessive capital expenditures. in the meantime, some giant players reveal steady income of their PCB/substrate enterprise.”

Seung Wook Yoon, director of community know-how approach for the JCET community, the father or mother enterprise of STATS ChipPAC, describes SLP as “a game changer for the business.”

SLP may suggest that outsourced semiconductor assembly and verify (OSAT) consumers received’t ought to make a choice from PCBs or substrates for his or her items. He expects Samsung to observe Apple’s illustration.

Fan-out wafer-level packaging is for prime-end utility processors going into top class items, the flagship smartphone models for handset providers, in keeping with Yoon. SLP is intended for the motherboard of phones, cutting back the area vital for such assemblies. Ball grid arrays or flip-chip programs are extra typically used for high-quality-pitch slots in a phone, he referred to. Wafer-degree packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the point the place they can present integration besides interconnection, in response to Yole. Yoon echoed that commentary. “this is chiefly for the combination,” he says.

while the first noteworthy implementation of SLP is in cellphones, such superior semiconductor packaging may also locate applications in 5G wireless communications, synthetic intelligence, augmented and digital fact, automotive electronics, and internet of things instruments.

When it comes to superior packaging, equipment-in-kit expertise and modules are other leading area-saving improvements, Yoon notes. “The charge could be larger,” he says.

He sees SLP might be being used in IoT devices, apart from cell phones. reducing the cost and the dimension continue to be the leading considerations.

airtight packaging and sealingHermetic packaging and sealing, meanwhile, is already ubiquitous. it is utilized in automotive electronics, aerospace and aviation techniques, optical conversation components and system for fiber-optic information telecommunications, sensor manufacturing, and other industrial functions. The airbag igniter in cars is one illustration of hermetic packaging.

“It’s hard to pinpoint only one overarching style,” referred to Robert Hettler, head of R&D for optoelectronics at SCHOTT digital Packaging, a unit of SCHOTT North the united states and Germany’s SCHOTT AG. “however, there are a few trends inside numerous markets and purposes.”

larger precision is considered one of them. the area’s ever-growing to be hunger for statistics and sooner transmission charges has expanded demand for better-efficiency chips.

“quicker chips need professional, high-efficiency hermetically sealed packaging to achieve ever-faster data prices. The so-referred to as ‘final mile’ to the customer, which covers fiber transmission lines to the home, can be unachievable with out a brand new technology of excessive-performance, high-precision airtight applications,” says Hettler. “SCHOTT recently introduced 50G hermetic transistor define can applications, which can pave the way for tons-needed bandwidth raises on datacom networks. 50G transistor outline (TO) know-how will also enable faster facts transmission to wireless telephone towers, presenting a expertise that should be used to installation 5G cellular networks, an improvement a good way to convey speeds exponentially faster than current 4G infrastructure.”

He additionally cites the diversity in materials used for airtight packaging and sealing.

“On a fabric level, there was a rise in demand for the use of non-magnetic materials, like titanium and niobium, which are interesting substances for a number of excessive-reliability applications. Glass-titanium compounds are exceptionally neatly-desirable to be used in the areas of aviation, aerospace, oil and gasoline, and scientific expertise — if non-magnetic yet lightweight housings are vital. alternatively, nickel-copper alloys are supreme for chemically aggressive environments as a result of its acid and alkali resistance,” Hettler says. “In medical electronics, the fashion toward implantable contraptions is also leading to a rise well-liked for using biocompatible substances like titanium and tantalum. here, the development of particularly authentic, yet further and further miniaturized airtight packaging is of the essence. The development of glass-to-aluminum sealing expertise now allows the manufacture of airtight feedthroughs made with aluminum. This fabric is totally wonderful for applications during which there is a need for lightweight substances or the place aluminum is customarily used for the casing, similar to supercapacitors, electric powered double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid techniques with airtight glass-to-aluminum sealed feedthroughs support greater or longer-lasting efficiency of capacitors and batteries.”

Miniaturization in modern-day electronics is a precedence, and hermetic packaging and sealing can handle that want.

“Miniaturization in hermetic glass-to-metallic and ceramic-to-metallic sealed programs is a major element of focal point,” he says. “expanding application demands, specifically for smaller and smaller form-element components, have made miniaturization a key subject matter in product innovation. a very vital instance can also be found in the fiber-optic enviornment as TO programs for prime-pace statistics transmission were reduced in size for brand new, reducing-area functions: within the development and transition from TO56 to TO38 programs, the footprint shrank with the aid of almost 33%. anyway miniaturization of hermetic glass-to-metallic and ceramic-to-metallic packaging, full-ceramic multilayer housings and substrates event expanded interest. Multilayer ceramics help the becoming trend towards miniaturization, cater for more advantageous complexity requirements however additionally offer astonishing thermal management houses: The multilayer design allows the construction of miniature 3D interconnect options, paving the way for prime-density input/output potential in small-form-ingredient airtight packages for both feedthroughs and multilayer ceramic circuit board substrates. sophisticated thermal conductivity of high-temperature co-fired ceramics and temperature resistance past 300 degrees Celsius (572 levels F) make HTCC substrates an ideal fit for top-energy purposes.”

How is airtight packaging and sealing being used these days?

“the most commonplace uses for hermetic seals range extensively across various areas,” Hettler says. “one of the most wonderful makes use of include fiber optics and high-velocity records switch, car defense systems and different add-ons, and pressure sensor feedthroughs and packaging applications. within the protection, aviation, and aerospace industries, airtight housings and connectors are sometimes used to protect reliability-critical manage and instrumentation electronics.”

Microelectromechanical device instruments are one enviornment the place hermetic packaging and sealing are required, now not just a technology that’s good to have in certain applications.

“MEMS are sensitive and fragile accessories that are often positioned in harsh environments, or in locations during which alternative is costly and inconvenient. airtight packaging and sealing offers legitimate protection that may assist prolongate the lifetime of those gadgets,” he says. “as an instance, SCHOTT HermeS glass wafer substrates with hermetically sealed solid metallic through-glass vias allow miniaturized yet enormously legitimate and effective 3D wafer-stage chip-scale packaging. The exceptional-pitched vias permit the reputable conduction of electrical alerts and power into and out of the MEMS machine. the use of glass wafers in airtight packaging has improved unexpectedly in fresh years. The core reasons are the sophisticated properties glass offers as a packaging fabric in selected, including its biocompatibility, the outstanding transparency to radio frequencies and the transparency to seen light, which allows a wide array of optical functions. TGV expertise allow long-term, respectable and very rugged packaging of business sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can demand lots of new packaging technologies. Then once more, tried-and-genuine procedures, comparable to hermetic packaging and sealing, can also fill the bill.




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Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging.

Two interesting packaging innovations are now being used in the process of miniaturizing microchips and electronics. One is a new concept that combines two tried-and-true technologies. The other is a decades-old technique that is being used in new ways.

Keeping dirt, humidity, air, even atmospheric pressure away from electronics is what hermetic packaging and sealing processes have done almost since the age of dinosaurs–for more than 75 years, predating the transistor and the integrated circuit. The process of hermetic packaging and sealing puts an impenetrable layer around electronics that keeps air (gas) and water vapor away from electronic parts, making them air- and water-tight, thus protecting them from corrosion and other environmental hazards.

New developments in hermetic packaging and sealing are now making faster, lighter, and smaller electronics possible.

Any technology that helps cram in more components without sacrificing functions is also welcome to handset manufacturers. Another technology front in the quest for greater miniaturization is the substrate-like printed circuit board, or SLP. It represents a cross between a flexible substrate and a rigid board.

The SLP shows up only in smartphones now, but it may be used in IoT devices and eventually AI applications, augmented and virtual reality devices, and automobiles. One of the big advantages is the flexibility of not having to choose between a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs were employed in assembling the iPhone 8 models and the iPhone X, according to Yole Développement, which describes the technology as “a clash of two worlds,” PCBs and substrates. SLP could prove to be an alternative to modified semi-additive processes, also known as mSAP, according to Yole.

“Advanced substrates must answer demands on both the scaling and functional roadmaps,” writes Emilie Jolivet, a technology and market analyst at Yole. “The transition from the subtractive to the mSAP process and from PCB to substrate-like PCB is under way in high-end smartphones, driven by Apple and its iPhone 8/iPhone X. Other high-end smartphone suppliers, such as Samsung and Huawei, are expected to join in the near future.”

SLP will have to contend with other technologies, namely package substrate vs. no substrate with fan-out platforms, along with through-silicon via packaging vs. TSV-less packaging.

Yole forecasts the SLP market will increase from $1.9 billion in 2016 to $2.24 billion by 2023.

“The 28 selected PCB/substrate manufacturers are all believed to have mSAP technology, and some of them can manufacture SLP,” said Yole’s Vivienne Hsu. “Driven by high-end smartphone demand, certain players appear to have high capital expenditures. Meanwhile, some large players show steady revenue in their PCB/substrate business.”

Seung Wook Yoon, director of group technology strategy for the JCET Group, the parent company of STATS ChipPAC, describes SLP as “a game changer for the industry.”

SLP could mean that outsourced semiconductor assembly and test (OSAT) customers won’t have to choose between PCBs or substrates for their products. He expects Samsung to follow Apple’s example.

Fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors, according to Yoon. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are more typically used for fine-pitch slots in a phone, he noted. Wafer-level packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the point where they can offer integration in addition to interconnection, according to Yole. Yoon echoed that observation. “This is mainly for the integration,” he says.

While the first noteworthy implementation of SLP is in mobile phones, such advanced semiconductor packaging could also find applications in 5G wireless communications, artificial intelligence, augmented and virtual reality, automotive electronics, and Internet of Things devices.

When it comes to advanced packaging, system-in-package technology and modules are other leading space-saving innovations, Yoon notes. “The cost may be higher,” he says.

He sees SLP possibly being used in IoT devices, in addition to mobile phones. Reducing the cost and the size remain the prime considerations.

Hermetic packaging and sealingHermetic packaging and sealing, meanwhile, is already ubiquitous. It is used in automotive electronics, aerospace and aviation systems, optical communication components and system for fiber-optic data telecommunications, sensor manufacturing, and other industrial applications. The airbag igniter in automobiles is one example of hermetic packaging.

“It’s hard to pinpoint just one overarching trend,” said Robert Hettler, head of R&D for optoelectronics at SCHOTT Electronic Packaging, a unit of SCHOTT North America and Germany’s SCHOTT AG. “However, there are a number of trends within various markets and applications.”

Higher precision is one of them. The world’s ever-growing hunger for data and faster transmission rates has increased demand for higher-performance chips.

“Faster chips need reliable, high-performance hermetically sealed packaging to achieve ever-faster data rates. The so-called ‘last mile’ to the customer, which covers fiber transmission lines to the home, would be unachievable without a new generation of high-performance, high-precision hermetic packages,” says Hettler. “SCHOTT recently introduced 50G hermetic transistor outline can packages, which can pave the way for much-needed bandwidth increases on datacom networks. 50G transistor outline (TO) technology will also enable faster data transmission to wireless cell towers, providing a technology that will be used to deploy 5G cellular networks, an improvement that will deliver speeds exponentially faster than current 4G infrastructure.”

He also cites the variety in materials used for hermetic packaging and sealing.

“On a material level, there has been an increase in demand for the use of non-magnetic materials, like titanium and niobium, which are interesting materials for a number of high-reliability applications. Glass-titanium compounds are especially well-suited for use in the areas of aviation, aerospace, oil and gas, and medical technology — if non-magnetic yet lightweight housings are needed. Alternatively, nickel-copper alloys are ideally suited for chemically aggressive environments due to its acid and alkali resistance,” Hettler says. “In medical electronics, the trend toward implantable devices is also leading to an increase in demand for the use of biocompatible materials like titanium and tantalum. Here, the development of highly reliable, yet more and more miniaturized hermetic packaging is of the essence. The development of glass-to-aluminum sealing technology now enables the manufacture of hermetic feedthroughs made with aluminum. This material is highly interesting for applications in which there is a need for lightweight materials or where aluminum is typically used for the casing, such as supercapacitors, electric double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid systems with hermetic glass-to-aluminum sealed feedthroughs support higher or longer-lasting performance of capacitors and batteries.”

Miniaturization in modern-day electronics is a priority, and hermetic packaging and sealing can address that need.

“Miniaturization in hermetic glass-to-metal and ceramic-to-metal sealed packages is a main point of focus,” he says. “Increasing application demands, particularly for smaller and smaller form-factor components, have made miniaturization a key topic in product innovation. A particularly relevant example can be found in the fiber-optic arena as TO packages for high-speed data transmission have been reduced in size for new, cutting-edge applications: in the development and transition from TO56 to TO38 packages, the footprint shrank by nearly 33%. Besides miniaturization of hermetic glass-to-metal and ceramic-to-metal packaging, full-ceramic multilayer housings and substrates experience increased interest. Multilayer ceramics support the growing trend towards miniaturization, cater for enhanced complexity requirements but also offer excellent thermal management properties: The multilayer design enables the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form-factor hermetic packages for both feedthroughs and multilayer ceramic circuit board substrates. Superior thermal conductivity of high-temperature co-fired ceramics and temperature resistance beyond 300 degrees Celsius (572 degrees F) make HTCC substrates a perfect fit for high-power applications.”

How is hermetic packaging and sealing being used today?

“The most popular uses for hermetic seals vary widely across many different areas,” Hettler says. “Some of the most notable uses include fiber optics and high-speed data transfer, automotive safety systems and other components, and pressure sensor feedthroughs and packaging applications. In the defense, aviation, and aerospace industries, hermetic housings and connectors are often used to protect reliability-critical control and instrumentation electronics.”

Microelectromechanical system devices are one area where hermetic packaging and sealing are required, not just a technology that’s good to have in certain applications.

“MEMS are sensitive and fragile components that are often placed in harsh environments, or in places in which replacement is expensive and inconvenient. Hermetic packaging and sealing provides reliable protection that can help prolongate the lifetime of these devices,” he says. “For example, SCHOTT HermeS glass wafer substrates with hermetically sealed solid metal through-glass vias enable miniaturized yet highly reliable and robust 3D wafer-level chip-scale packaging. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. The use of glass wafers in hermetic packaging has increased rapidly in recent years. The core reasons are the superior properties glass offers as a packaging material in particular, including its biocompatibility, the excellent transparency to radio frequencies and the transparency to visible light, which enables a wide range of optical applications. TGV technology enable long-term, reliable and extremely rugged packaging of industrial sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can call for a variety of new packaging technologies. Then again, tried-and-true approaches, such as hermetic packaging and sealing, can also fill the bill.


Xiaomi to bring crowdfunding platform to India | killexams.com real questions and Pass4sure dumps

Xiaomi to bring crowdfunding platform to India

Chinese tech firm Xiaomi may soon bring its 'crowdfunding' platform to India that will help start-ups working on consumer electronics to sell their wares through the medium.

In China, Xiaomi runs a crowdfunding platform where hardware start-ups submit their products and consumers can book them, helping these companies raise funds in the process.

While these are not Xiaomi-branded, the products are compatible with Xiaomi's Mi Home app.

"We are open to bringing the programme but we will have to change certain things before we can launch it in India," Xiaomi Vice President Hugo Barra told .

Xiaomi, which is betting big on the Internet of Things (IoT) space with its Mi Ecosystem, has invested in 55 start-ups that work on connected devices ranging from air purifiers to drones.

Talking about the challenges of bringing the platform to India, Barra cited the example of certifications that electronics products need for selling in the country, which takes anywhere between 3-6 months to get.

"Consumers pay the money in advance and it wouldn't be fair if they had to wait for such a long time before they get the product delivered. We will have to figure out these challenges before we can bring the programme here," he said.

Xiaomi today launched its air purifier -- Mi Air Purifier 2 -- in India, its first home category product in the country.

Priced at Rs 9,999, the air purifier on the auto mode, adjusts the speed of the device's motor automatically, according to the air quality measured using built-in sensors. Since the device is WiFi-compatible, it connects to Xiaomi's Mi Home app. It also monitors the filter's lifespan and sends a reminder when it needs to be replaced. The replacement filter will be priced at Rs 2,499.

"Air pollution is becoming an alarming public health concern in India. It is heartening to see more conversation around the situation, but there is still a big gap when it comes to consumer awareness. We believe that we are able to play a role in increasing awareness about air pollution by including Air Quality Index (AQI) data into our MIUI Weather app, and by introducing Mi Air Purifier 2 to India," Barra said.

The air purifier will be available on Mi.com from September 26 and on Flipkart from October 2.

Xiaomi has a range of products like robot vacuum cleaners, security cameras, water filters, smart rice cookers, smart televisions and hover boards that are available in its home market.

"Our focus is on re-defining the consumer electronics segment by bringing in innovation at affordable prices. We will gradually bring the other home products to the Indian market as well," Barra said.

He added that the company may launch its smart rice cooker next year in India.

Xiaomi is also launching the new version of its Mi Band 2, priced at Rs 1,999. It features an OLED display, has a battery life of 20 days on a single charge and is IP67 splash-resistant. It has a fitness, sleep and optical heart rate tracker and allows users to unlock their phones and provides call and app alerts.

Mi Band 2 will be available on Mi.com from September 27 and on Amazon.in from September 30.

Global LAN/WAN Test Equipment Industry | killexams.com real questions and Pass4sure dumps

TMCNet: Global LAN/WAN Test Equipment Industry

LONDON, June 11, 2018 /PRNewswire/ -- This report analyzes the worldwide markets for LAN/WAN Test Equipment in US$ Thousand by the following Product Segments: Protocol Analyzers, Performance Analyzers & Stress Testers, and Conformance & Interoperability Test Systems.

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The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World.

Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

The report profiles 52 companies including many key and niche players such as:- Anritsu Corporation- AOIP- Averna- EXFO Inc.- Fortive Corporation- Greenlee Textron, Inc.

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LAN/WAN TEST EQUIPMENT MCP-1797 A GLOBAL STRATEGIC BUSINESS REPORT CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting LimitationsDisclaimersData Interpretation & Reporting LevelQuantitative Techniques & AnalyticsProduct Definitions and Scope of StudyProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test Systems

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEWLAN/WAN Test Equipment Market: An Introductory PreludeNorthbound Trajectory in the Global ICT Sector Creates Conducive EnvironmentCSPs' Thrust Towards QoS & QoE Propagates Large-Scale OpportunitiesDeveloped Nations: Key Revenue ContributorsTable 1: Developed Regions Account for over 70% Share of the World LAN/WAN Test Equipment Market - Percentage Breakdown of Revenues for Developed and Developing Regions (2018E & 2022P) (includes corresponding Graph/Chart)Market Senses Huge Opportunities in Developing NationsTable 2: Global LAN/WAN Test Equipment Market - Geographic Regions Ranked by % CAGR for 2015-2022: Asia-Pacific (excluding Japan), Rest of World, Canada, Europe, US, and Japan (includes corresponding Graph/Chart)Assessing the Impact of Recent Economic Upheavals on LAN/WAN Test Equipment MarketStable Economic Scenario to Augment Market Demand in the Near- TermTable 3: World Real GDP Growth Rates in % (2016-2018P): Breakdown by Country/Region (includes corresponding Graph/Chart)Competitive LandscapeLeading Players in the Global LAN/WAN Test Equipment MarketVendors Prioritize M&A Route to Enhance Business OperationsSelect M&A Deals in the Global LAN/WAN Test Equipment Market (2014-2018)Pricing Scenario

2. KEY PRODUCT & APPLICATION MARKET TRENDSPerformance Analyzers & Stress Testers: The Key Product SegmentTable 4: World LAN/WAN Performance Analyzers & Stress Testers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Protocol Analyzers Continue to Generate RevenuesNoteworthy Trends in Protocol Analyzers SegmentBluetooth Protocol Analyzers Gather SeamPCIe Protocol Analyzers Assume ImportanceDOCSIS Protocol Analyzers Make a CutTable 5: World LAN/WAN Protocol Analyzers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Conformance & Interoperability Test Systems: Critical for Network EquipmentKey factors Responsible for Interoperability Issues: A SnapshotTable 6: World LAN/WAN Conformance & Interoperability Test Systems Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers and Private Enterprises (includes corresponding Graph/Chart)Test Equipment Gain Precedence in Network R&D, I&M & ProductionModular Test Equipment Make Their WayCloud-based SaaS Solutions Seek Role in LAN/WAN Testing SpaceProgression in Network Technologies: A Challenge to Test Equipment Vendors

3. KEY END-USE MARKET TRENDSEscalating Telecom & Datacom Traffic Volumes & Subsequently Rising Need to Augment Network Efficiency Builds Strong Business CaseTable 7: Global IP Traffic Volume in Exabytes (2014, 2016, 2018E & 2020P) (includes corresponding Graph/Chart)Table 8: Global IP Traffic Scenario by Region/Country (2017): Percentage Breakdown of Internet Data Consumption for North America, Japan, Europe, Asia-Pacific, Latin America, and Rest of World (includes corresponding Graph/Chart)Table 9: Global IP Traffic Scenario by Consumer Segment (2017): Percentage Breakdown of Internet Consumption for General and Business Consumers (includes corresponding Graph/Chart)Key Factors Influencing Telecom & Datacom Traffic GrowthSharp Increase in the Number of Internet SubscribersTable 10: Global Internet Usage by Geographic Region (2017): Percentage Breakdown of Number of Internet Users for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Table 11: Global Internet Usage by Geographic Region (2017): Penetration Rate of Internet (as a % of Total Population) for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Faster Broadband SpeedsSurging Investments on Advanced Telecom Infrastructure Extends Parallel OpportunitiesNetwork Test Equipment Assume Critical Importance in Wireless NetworksWi-Fi Roll Outs Bodes Well for Network Test Equipment Market GrowthContinued Evolution in IEEE 802.11 Standards Generates Parallel OpportunitiesWider Uptake of Smartphones Instigates Expansion in Wireless NetworksTable 12: Global Portable Devices Market by Device Type (2017 & 2020P): Percentage Breakdown of Unit Sales for Laptops, M2M Devices, Non-Smartphones, Smartphones, Tablets, and Others (includes corresponding Graph/Chart)Upcoming 5G Technology to Drive New Line of OpportunitiesExpanding Role of Fiber Optic Networks Offer OpportunitiesKey Trends Driving Growth in Fiber Optic Network DeploymentsSoaring Investments on EPON & GPON TechnologiesTests for Passive Optical Networks (PONs): A SnapshotProliferation of FTTx NetworksISPs Put Focus on Test Equipment Amid Soaring Demand for Gigabit Access ServicesNEMs Bet on Test Equipment in Equipment Design & DevelopmentTest Equipment for Seamless Deployment & Operation of Enterprise IT NetworksBusiness Continuity & Security Needs Propagate Demand for Enterprise-Grade Test EquipmentExpanding Image of Enterprise Mobility Creates Business CaseLAN/WAN Test Equipment Benefit from Sustained Demand for VoIPEmerging IoT to Widen the Scope & Span of Network Test EquipmentM2M Communication Networks Set to Instigate New Opportunities

4. PRODUCT OVERVIEWLocal Area Network (LAN)DefinitionFactors Differentiating Various LANsTopologyBus TopologyRing TopologyStar TopologyProtocolsMediaWide Area Network (WAN)LAN/WAN Test EquipmentProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test SystemsOther Testing Tools for LAN/WANCable TesterBit-Error Rate Tester (BERT)Personal Network AnalyzersPhysical Layer Tools for Testing LANCapacitance MeterNoise MeterPower MeterOhmmeterTime Domain ReflectometerHigh Frequency Signal GeneratorLine MapperTerminatorsMatching TerminatorShorting TerminatorEnhancements in LAN Testing CapabilitiesWireless LAN - An OverviewComparing 802.11ad, 802.11af and 802.11ah ProtocolsGrowth Drivers for WLAN MarketPros and Cons

5. PRODUCT INTRODUCTIONS/INNOVATIONSTektronix Rolls Out 59 GHz DPO7OE2 Single Mode Optical ProbeIDEAL Networks Releases Software Updates for SignalTEK CT and SignalTEK NT TestersSpirent Communications Develops World's Highest Density 400/ 200/100/50GbE Test SystemTeledyne LeCroy Expands Link Layer Compliance Tests PortfolioVeEX Introduces RXT-6200 Universal 100G Test Module for RXT- 1200 PlatformVIAVI Solutions Upgrades Cable Signal Meters with Trilithic' Leak Detection TechnologyEXFO Rolls Out SkyRAN Proactive Test & Monitoring Solution for RF Interference & Fronthaul NetworksAnritsu Unveils Radio Communication Test Station MT8000A PlatformNational Instruments Develops LabView NXG 1.0Netscout Systems Unveils LinkRunner™ G2 Android-based Smart Network TesterVIAVI Solutions Rolls Out FiberChek SidewinderViavi Solutions Introduces Xgig 4K16 Protocol Analyzer/Jammer for PCI Express 4.0 TechnologySaelig Unveils USB-Powered Bluetooth Protocol AnalyzerKeysight Technologies Launches Industry's First 5G Protocol Test SolutionTeledyne Leroy Launches LinkExpert Software Interface for its PCIe Protocol Analyzers

Teledyne LeCroy Introduces Eclipse M32 UniPro/ UFS Protocol Analyzer/ExerciserSpirent Communications Rolls Out World's First 200G Ethernet Test SystemFuturePlus Systems Introduces industry's First HBR3 DisplayPort Protocol Analysis ToolEXFO Releases FTBx-88400NGE Power Blazer 400G Testing SolutionAnritsu Develops ME7800L Conformance Test SystemSpirent Unveils First Automotive Ethernet Protocol Conformance & Performance Test System with 1000BASE-T1 Physical Layer StandardIntrospect Technology Enhances SV3C Personal SerDes Tester with DSLineeye Releases LE-3500R & LE-2500R Multi-Protocol AnalyzersAnritsu Rolls Out CPRI RF Module for Network Master Pro™ MT1000A TesterIxia Rolls Out TrafficREWIND™Teledyne LeCroy Unveils T416 PCIe AnalyzerTeledyne LeCroy Rolls Out Sodera LE AnalyzerSpirent Introduces Spirent Vertex Channel Emulator for Wireless RF TestingSpirent Unveils Spirent TestCenter WLAN Test PlatformSpirent Expands Elevate™ Test Framework & Prolab™ Test Suite for EVS Codec TestingSpirent Launches Spirent TemevaSpirent Introduces Spirent Landslide™ C100-M2 Test PlatformSpirent Launches CyberFlood™ Security & Performance Testing SolutionAnritsu Introduces OTDR Module for Network Master™ Pro MT1000A TesterGL Communications Unveils PacketExpert 10G Ethernet/IP TesterGreenlee® Introduces AirScout™ Wi-Fi Readiness Test SolutionIDEAL Networks Launches LanTEK® II Cable CertifierFrontline Rolls Out ComProbe Sodera Wideband Bluetooth Protocol AnalyzerSpirent Rolls Out 50GbE Boost Ethernet Test SolutionTeledyne LeCroy Introduces Voyager M310C USB Protocol Analyzer and Exerciser SystemSpirent Unveils DX2-100GbE QSFP28 and CFP4 8-Port ModulesIxia unveils 25GbE Validation SolutionAnritsu Receives LTE 3CA PTCRB Certification for ME7873LA LTE- Advanced RF Conformance Test SystemAnritsu Unveils Remote Spectrum Monitor

6. RECENT INDUSTRY ACTIVITYoneM2M Selects Spirent's Compliance Testing ToolsTeledyne LeCroy Receives Bluetooth SIG's Validation for Harmony LE TesterViavi Solutions Acquires Cobham's AvComm and Wireless T&M BusinessesNI to Collaborate with Samsung to Develop 5G Test UEs for 5G NRRiverbed Launches Riverbed Rise Channel Partner ProgramEXFO Partners with KontronEXFO Acquires Majority Stake in AstelliaSpirent Communications Announces Spirent Pace Global Partner ProgramEXFO Teams Up with ADVAEXFO Collaborates with China Mobile for IoT Network TestingHuawei Endorses Anritsu's MT8870A Test Platform for RF Calibration & Validation TestsSamsung Selects Anritsu's Signal Analyzer MS2850A for 5G System DevelopmentsNational Instruments Acquires AWRFluke Networks Snaps Up ClearSight NetworksKeysight Technologies Acquires IxiaEXFO Acquires Yenista OpticsAnritsu Inks Distribution Agreement with Comtec Cable AccessoriesIDEAL Networks Opens New Office in ShanghaiIDEAL Networks Launches New Office in MelbourneTeledyne Lecroy Acquires Quantum DataAnritsu Acquires Azimuth SystemsNoviFlow Teams Up with IxiaArrow Electronics Inks Distribution Agreement with IxiaIxia Joins New IP Agency (NIA)QualiTest Joins Ixia's Global Solution Provider ProgramTeledyne Technologies Acquires Frontline Test EquipmentSpirent Acquires Testing TechnologiesT-Mobile Netherlands Selects Anritsu's MasterClaw™ Service Assurance SystemChina Unicom Teams Up with Spirent to Test Virtualization MiddlewareVector Informatik Collaborates with IxiaSpirent Takes Over EpitiroSimplay™ Labs Receives Evaluation Approval for SL-8810 Miracast HDCP 2.2 Test Tool from DCPTeledyne LeCroy Extends Capabilities of PCI Protocol Analyzer Product FamilyIntel Selects Averna's DP-1000 DOCSIS Protocol AnalyzerFortinet Collaborates with Spirent to Validate FortiGate®- 3810D Firewall ApplianceSGS Deploys Spirent 8100 LTE Solution to Enhance Critical Test CapabilitiesViavi Solutions Establishes Lumentum

7. FOCUS ON SELECT GLOBAL PLAYERSAnritsu Corporation (Japan)AOIP (France)Averna (Canada)EXFO, Inc. (Canada)Fortive Corporation (USA)Fluke Corporation (USA)Tektronix, Inc. (USA)Greenlee Textron, Inc. (USA)IDEAL INDUSTRIES, INC. (USA)Keysight Technologies, Inc. (USA)Ixia (USA)National Instruments Corporation (USA)NetScout Systems, Inc. (USA)Riverbed Technology, Inc. (USA)Rohde & Schwarz (Germany)Spirent Communications plc (UK)Teledyne LeCroy (USA)VeEX, Inc. (USA)Digital Lightwave (USA)Viavi Solutions, Inc. (USA)Wilcom Inc. (USA)

8. GLOBAL MARKET PERSPECTIVETable 13: World Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 14: World Historic Analysis for LAN/WAN Test Equipment by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 15: World 14-Year Perspective for LAN/WAN Test Equipment by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)Analytics by Product SegmentTable 16: World Recent Past, Current & Future Analysis for Protocol Analyzers (PA) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 17: World Historic Analysis for Protocol Analyzers (PA) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 18: World 14-Year Perspective for Protocol Analyzers (PA) by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)Table 19: World Recent Past, Current & Future Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 20: World Historic Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 21: World 14-Year Perspective for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)Table 22: World Recent Past, Current & Future Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 23: World Historic Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 24: World 14-Year Perspective for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATESA.Market AnalysisThe Prime Market for LAN/WAN Test EquipmentTable 25: US Accounts for Over 2/5th Share of the World LAN/WAN Test Equipment Market - Percentage Breakdown of Revenues for US and Rest of World (2018E & 2022P) (includes corresponding Graph/Chart)Performance Analyzers & Stress Testers - Order of the DayProtocol Analyzers - A Key Product CategoryMarket Witnesses Shift from Conventional Protocol AnalyzersConformance & Interoperability Test Systems - Witnessing Buoyant GrowthCompetitive ScenarioImpact of 2007-2009 Economic Recession in RetrospectProduct LaunchesStrategic Corporate DevelopmentsSelect Key PlayersB.Market AnalyticsTable 26: US Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 27: US Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 28: US 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

2. CANADAA.Market AnalysisRobust Investments on Wi-Fi & Mobile Network Deployments Generate OpportunitiesProduct LaunchesCorporate DevelopmentSelect Key PlayersB.Market AnalyticsTable 29: Canadian Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 30: Canadian Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 31: Canadian 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

3. JAPANA.Market AnalysisProduct LaunchesKey PlayerB.Market AnalyticsTable 32: Japanese Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 33: Japanese Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 34: Japanese 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

4. EUROPEA.Market AnalysisA Mature MarketIncreasing Deployment of Wireless Networks Bolster Market GrowthContinued Investments on LTE Networks Drives Wireless Test Equipment MarketStrategic Corporate DevelopmentsProduct LaunchSelect Key PlayersB.Market AnalyticsTable 35: European Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 36: European Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 37: European 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

5. ASIA-PACIFICA.Market AnalysisHigh-Potential Opportunities Prevail in the Asia-Pacific RegionAdvancements in Communication Infrastructure Drive DemandRapidly Growing Outdoor Wi-Fi Deployments Bode WellCompetition Set to IntensifyWireless Test Equipment Market in China: An OverviewGrowing Outdoor Wi-Fi Roll OutsWireless Test Equipment Market in IndiaOutdoor Wi-Fi Gathers SteamProduct LaunchStrategic Corporate DevelopmentsB.Market AnalyticsTable 38: Asia-Pacific Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 39: Asia-Pacific Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 40: Asia-Pacific 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

6. REST OF WORLDMarket AnalysisTable 41: Rest of World Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 42: Rest of World Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 43: Rest of World 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 52 (including Divisions/Subsidiaries - 60) The United States (30) Canada (6) Japan (3) Europe (11) - France (2) - Germany (2) - The United Kingdom (4) - Rest of Europe (3) Asia-Pacific (Excluding Japan) (10)Download the full report: https://www.reportbuyer.com/product/4484181

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Blogspot : http://killexams-braindumps.blogspot.com/2017/11/pass4sure-su0-211-real-question-bank.html
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publitas.com : https://view.publitas.com/trutrainers-inc/pass4sure-su0-211-real-question-bank
Calameo : http://en.calameo.com/books/0049235267adf7c74a709
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