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SU0-211 - Huawei Cert Datacom Associate-Network(R) Technology and Device - BrainDump Information

Vendor Name : Huawei
Exam Code : SU0-211
Exam Name : Huawei Cert Datacom Associate-Network(R) Technology and Device
Questions and Answers : 865 Q & A
Updated On : March 18, 2019
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SU0-211 exam Dumps Source : Huawei Cert Datacom Associate-Network(R) Technology and Device

Test Code : SU0-211
Test Name : Huawei Cert Datacom Associate-Network(R) Technology and Device
Vendor Name : Huawei
Q&A : 865 Real Questions

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Huawei Huawei Cert Datacom Associate-Network(R)

We did it once again: Hill+Knowlton Canada is a good area to Work™ for 12th yr running | killexams.com Real Questions and Pass4sure dumps

TORONTO, April 26, 2018 /CNW/ - The surveys are in and the submissions were graded. With handiest six different companies in Canada which have been named one of the vital country's ultimate workplaces for the twelfth consecutive yr, Hill+Knowlton options Canada (H+k) is proud to be among them. in keeping with remarks from tens of heaps of personnel throughout Canada, the annual record appears these days in a Globe and Mail particular country wide file.  

"every year, we are trying to do extra for our employees and we're thrilled that they've helped us earn a further yr on the celebrated top-rated offices checklist," says Goldy Hyder, president and CEO of H+k. "We be aware of that an organization cannot create its personal tradition; its individuals create it and live it. Our job is effortlessly to deliver an atmosphere that fosters it."

Hill+Knowlton Canada is additionally a proud recipient of the 2018 first rate vicinity to Work Certification application. Now in its third yr, the Certification an enhancement to the most useful offices application and requires companies earn a selected have faith Index rating all through the submission procedure.

"We're working hard at H+okay to build the kind of place of work where all and sundry matters. where all of us attain new heights. the place range and inclusion are cornerstones. the place ethics and integrity are every little thing. Working inside a tradition of innovation where we take dangers, include exchange and evolve — all to be certain our people thrive," adds Hyder. "beyond challenging work, we offer a full suite of first-price merits and incentives. even if it be our peer-driven bonus application, mighty health subsidy, committed pro bono days, or presents of time that include additional-long weekends and a birthday vacation day, H+Kers were the driving drive behind a lifestyle that embraces work-existence balance."

Jose Tolovi Neto, the managing accomplice of extraordinary area to Work®Canada, concurs: "In an industry it's perpetually evolving, communications organizations require discipline and consistency to stay fantastic workplaces for personnel. Being able to celebrate its 12th year as a member of the top-quality offices™ in Canada is a tremendous accomplishment for Hill+Knowlton. It continues to deliver excellent employee experiences and create a good company tradition." 

most reliable places of work Award criteriaThe competitors for "top-rated workplaces in Canada" is in keeping with two standards: two-thirds of the full rating comes from an in-depth survey achieved by a minimal variety of personnel, together with open-ended comments about the corporation; the closing one-third of the score comes from a evaluate of the organization's subculture, including an assessment of HR policies, methods and advantages. This offers a rigorous illustration of the firm from an worker standpoint, and an standard portrait of the office culture. The process is an unbiased analysis conducted by way of the super place to Work Institute.

outstanding region to Work®notable region to Work® (outstanding region to Work® Institute Canada) is the global authority on excessive-have confidence, excessive-performance office cultures. we're a research and consulting company whose mission is to build a more robust society by means of helping corporations seriously change their offices. through proprietary assessment equipment, advisory capabilities and organization branding courses, including place of work certification and most effective workplaces lists, amazing area to Work® offers the benchmarks, framework and abilities vital to create, sustain and admire astounding workplace cultures. In Canada, tremendous region to Work® produces the annual one hundred optimum places of work listing, released in a countrywide characteristic within the Globe and Mail. this is part of the realm's largest annual place of work analyze, which culminates in a series of country wide lists in pretty much 50 international locations, including the look at's flagship record of one hundred most suitable corporations published annually in Fortune magazine. Globally, this survey represents the voices of eleven million employees, including about 300,000 from Canada on my own. or not it's what makes this analyze so credible: the basic determinant utilized in deciding on winners is an worker survey. there may be only one solution to get on this checklist—and that's in case your employees put you there. comply with superb place to Work® on-line at www.greatplacetowork.ca and on Twitter at @GPTW_Canada.

Hill+Knowlton StrategiesWith nine workplaces throughout the nation, Hill+Knowlton StrategiesCanada is a leader in each public members of the family and public affairs. Headquartered in Toronto, the company is the No. 1-rated strategic communications firm within the nation. Its consultants concentrate on company communications, advertising and marketing communications, public affairs, citizen engagement, disaster, energy, know-how, fitness care, content advertising and marketing, research and size, social and digital communications, fiscal communications and transactions. The handiest communications firm to have earned the Canada Order of Excellence for quality from Excellence Canada, it has been identified as one of the crucial choicest workplaces in Canada for 12 consecutive years. Its dad or mum enterprise, Hill+Knowlton strategies Inc., has 86 workplaces in additional than 47 nations in addition to an in depth associate community; and it's a member of WPP (NASDAQ: WPPGY), one of the world's largest communications functions corporations.

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over the years, the semiconductor industry has witnessed a parade of packaging improvements, equivalent to system-in-equipment, semiconductor embedded in substrate, and fan-out wafer-stage packaging.

Two entertaining packaging innovations are actually getting used in the system of miniaturizing microchips and electronics. One is a new thought that combines two tried-and-genuine technologies. The different is a decades-historical approach that is getting used in new methods.

keeping grime, humidity, air, even atmospheric pressure away from electronics is what hermetic packaging and sealing approaches have performed very nearly in view that the age of dinosaurs–for more than seventy five years, predating the transistor and the integrated circuit. The method of airtight packaging and sealing puts an impenetrable layer round electronics that maintains air (fuel) and water vapor far from electronic parts, making them air- and water-tight, consequently holding them from corrosion and different environmental risks.

New traits in airtight packaging and sealing are actually making sooner, lighter, and smaller electronics viable.

Any expertise that helps cram in more components devoid of sacrificing capabilities is additionally welcome to handset producers. a different expertise entrance within the quest for better miniaturization is the substrate-like printed circuit board, or SLP. It represents a go between a flexible substrate and a rigid board.

The SLP shows up simplest in smartphones now, but it surely may well be used in IoT contraptions and finally AI applications, augmented and virtual reality devices, and automobiles. some of the big advantages is the pliability of no longer having to make a choice from a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs were employed in assembling the iPhone 8 fashions and the iPhone X, in accordance with Yole Développement, which describes the technology as “a clash of two worlds,” PCBs and substrates. SLP could prove to be an alternative choice to modified semi-additive processes, also referred to as mSAP, according to Yole.

“advanced substrates have to answer demands on each the scaling and practical roadmaps,” writes Emilie Jolivet, a technology and market analyst at Yole. “The transition from the subtractive to the mSAP system and from PCB to substrate-like PCB is beneath manner in excessive-end smartphones, pushed via Apple and its iPhone eight/iPhone X. other excessive-conclusion smartphone suppliers, corresponding to Samsung and Huawei, are expected to join in the near future.”

SLP will should take care of different technologies, namely equipment substrate vs. no substrate with fan-out structures, together with via-silicon via packaging vs. TSV-less packaging.

Yole forecasts the SLP market will raise from $1.9 billion in 2016 to $2.24 billion by 2023.

“The 28 selected PCB/substrate manufacturers are all believed to have mSAP know-how, and some of them can manufacture SLP,” observed Yole’s Vivienne Hsu. “pushed by using high-end smartphone demand, definite players seem to have excessive capital bills. meanwhile, some enormous gamers display constant revenue in their PCB/substrate enterprise.”

Seung Wook Yoon, director of group expertise method for the JCET community, the parent company of STATS ChipPAC, describes SLP as “a video game changer for the trade.”

SLP may imply that outsourced semiconductor assembly and look at various (OSAT) valued clientele received’t must choose between PCBs or substrates for their items. He expects Samsung to observe Apple’s example.

Fan-out wafer-level packaging is for high-end software processors going into top rate items, the flagship smartphone fashions for handset vendors, in line with Yoon. SLP is supposed for the motherboard of telephones, reducing the house vital for such assemblies. Ball grid arrays or flip-chip packages are greater usually used for quality-pitch slots in a mobilephone, he noted. Wafer-level packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the element the place they could present integration moreover interconnection, in accordance with Yole. Yoon echoed that remark. “here is in particular for the combination,” he says.

while the primary noteworthy implementation of SLP is in cellphones, such superior semiconductor packaging may additionally locate functions in 5G instant communications, synthetic intelligence, augmented and virtual reality, automotive electronics, and cyber web of things contraptions.

When it involves superior packaging, gadget-in-package expertise and modules are other leading space-saving innovations, Yoon notes. “The can charge could be better,” he says.

He sees SLP probably being used in IoT instruments, apart from cellphones. cutting back the cost and the dimension stay the major issues.

airtight packaging and sealingHermetic packaging and sealing, in the meantime, is already ubiquitous. it is utilized in automotive electronics, aerospace and aviation techniques, optical communication components and gadget for fiber-optic data telecommunications, sensor manufacturing, and different industrial applications. The airbag igniter in automobiles is one instance of airtight packaging.

“It’s challenging to pinpoint just one overarching style,” said Robert Hettler, head of R&D for optoelectronics at SCHOTT electronic Packaging, a unit of SCHOTT North the united states and Germany’s SCHOTT AG. “despite the fact, there are a couple of developments within quite a few markets and functions.”

larger precision is one among them. the realm’s ever-becoming hunger for facts and sooner transmission fees has increased demand for higher-performance chips.

“faster chips want legit, high-performance hermetically sealed packaging to achieve ever-faster information charges. The so-called ‘closing mile’ to the customer, which covers fiber transmission lines to the domestic, can be unachievable without a new generation of high-efficiency, excessive-precision airtight applications,” says Hettler. “SCHOTT recently added 50G hermetic transistor outline can packages, that could pave the way for lots-essential bandwidth raises on datacom networks. 50G transistor outline (TO) technology will also allow sooner data transmission to instant telephone towers, offering a technology that will be used to deploy 5G cellular networks, an growth that allows you to deliver speeds exponentially faster than existing 4G infrastructure.”

He additionally cites the range in substances used for hermetic packaging and sealing.

“On a cloth degree, there was an increase sought after for using non-magnetic materials, like titanium and niobium, that are unique materials for a couple of high-reliability applications. Glass-titanium compounds are above all smartly-acceptable for use within the areas of aviation, aerospace, oil and gas, and medical technology — if non-magnetic yet light-weight housings are crucial. however, nickel-copper alloys are perfect for chemically aggressive environments as a result of its acid and alkali resistance,” Hettler says. “In clinical electronics, the fashion toward implantable gadgets is also leading to an increase sought after for using biocompatible materials like titanium and tantalum. right here, the development of totally respectable, yet more and more miniaturized airtight packaging is of the essence. The development of glass-to-aluminum sealing know-how now allows the manufacture of hermetic feedthroughs made with aluminum. This cloth is extremely interesting for functions by which there is a need for light-weight substances or the place aluminum is customarily used for the casing, equivalent to supercapacitors, electric powered double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid programs with airtight glass-to-aluminum sealed feedthroughs assist higher or longer-lasting performance of capacitors and batteries.”

Miniaturization in contemporary-day electronics is a precedence, and hermetic packaging and sealing can address that need.

“Miniaturization in airtight glass-to-metal and ceramic-to-steel sealed applications is a primary element of center of attention,” he says. “increasing application demands, especially for smaller and smaller form-factor components, have made miniaturization a key theme in product innovation. a very crucial illustration can be present in the fiber-optic area as TO applications for prime-pace records transmission have been gotten smaller for brand new, chopping-side purposes: in the construction and transition from TO56 to TO38 packages, the footprint shrank by way of basically 33%. besides miniaturization of airtight glass-to-steel and ceramic-to-steel packaging, full-ceramic multilayer housings and substrates adventure multiplied hobby. Multilayer ceramics guide the becoming vogue towards miniaturization, cater for more advantageous complexity requirements but also present mind-blowing thermal administration houses: The multilayer design allows the construction of miniature 3D interconnect solutions, paving the style for prime-density input/output capability in small-kind-ingredient airtight applications for each feedthroughs and multilayer ceramic circuit board substrates. superior thermal conductivity of excessive-temperature co-fired ceramics and temperature resistance past 300 degrees Celsius (572 levels F) make HTCC substrates an ideal fit for prime-energy functions.”

How is hermetic packaging and sealing being used nowadays?

“the most universal uses for airtight seals fluctuate extensively across many different areas,” Hettler says. “one of the most exceptional uses encompass fiber optics and high-velocity records transfer, automobile safeguard systems and other add-ons, and pressure sensor feedthroughs and packaging purposes. in the protection, aviation, and aerospace industries, airtight housings and connectors are often used to offer protection to reliability-critical manage and instrumentation electronics.”

Microelectromechanical device gadgets are one enviornment the place airtight packaging and sealing are required, no longer only a know-how that’s respectable to have in definite purposes.

“MEMS are sensitive and fragile accessories that are sometimes placed in harsh environments, or in locations wherein substitute is expensive and inconvenient. airtight packaging and sealing provides legitimate insurance plan that can aid prolongate the lifetime of these contraptions,” he says. “for instance, SCHOTT HermeS glass wafer substrates with hermetically sealed strong steel through-glass vias enable miniaturized yet incredibly reliable and effective 3D wafer-degree chip-scale packaging. The excellent-pitched vias permit the authentic conduction of electrical indicators and energy into and out of the MEMS device. using glass wafers in hermetic packaging has multiplied impulsively in fresh years. The core motives are the sophisticated properties glass offers as a packaging cloth in particular, including its biocompatibility, the excellent transparency to radio frequencies and the transparency to seen gentle, which allows a wide array of optical purposes. TGV know-how permit long-time period, official and intensely rugged packaging of commercial sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can call for numerous new packaging technologies. Then again, tried-and-genuine approaches, equivalent to airtight packaging and sealing, can additionally fill the bill.


Molex Receives 2008 most appropriate Technical aid Award from Huawei applied sciences | killexams.com Real Questions and Pass4sure dumps

Huawei cites Molex's stunning consumer relationship management in aid of Huawei's R&D team as key to win

LISLE, sick. June 24, 2009 - Molex included (NASDAQ: MOLX and MOLXA) become awarded the 2008 "ideal Technical assist" award by using Huawei technologies Co. Ltd., a pacesetter in providing next era telecommunications network solutions for operators all over. The award recognizes Molex's continued information to and aid of Huawei's R&D crew in offering timely and professional technical counsel and powerful revenue and consumer carrier for Huawei's new product design.

"We're honored to have bought the "most suitable Technical aid" award from Huawei," stated Frank Tan, VP of APS earnings and marketing, Molex incorporated. "Molex labored closely with the Huawei R&D team to make sure prompt technical support and quick difficulty decision."

In recognizing Molex, Huawei executives noted that the enterprise's marvelous customer relationship administration has resulted in a extremely excessive stage of have faith in Molex's technical capabilities to supply main datacom options. said Zheng Yi, vice director of CEG, Huawei: "The Molex group even geared up an audit commute for the Huawei team to

Molex's Little Rock connector factory to assist us improved consider the business's manufacturing techniques."Molex is the handiest connector supplier to win this award from Huawei. Most these days, Huawei chose the Molex ImpactTM 6-pair standard backplane and daughtercard connectors.

For more tips, please discuss with www.molex.com.

About Molex integrated

Molex included is a 70-yr-old global brand of digital, electrical and fiber optic interconnection methods. based in Lisle, Illinois, u . s . a ., the company operates 45 manufacturing areas in 17 countries. The Molex web page is www.molex.com.

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Old Vs. New Packages | killexams.com real questions and Pass4sure dumps

Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging.

Two interesting packaging innovations are now being used in the process of miniaturizing microchips and electronics. One is a new concept that combines two tried-and-true technologies. The other is a decades-old technique that is being used in new ways.

Keeping dirt, humidity, air, even atmospheric pressure away from electronics is what hermetic packaging and sealing processes have done almost since the age of dinosaurs–for more than 75 years, predating the transistor and the integrated circuit. The process of hermetic packaging and sealing puts an impenetrable layer around electronics that keeps air (gas) and water vapor away from electronic parts, making them air- and water-tight, thus protecting them from corrosion and other environmental hazards.

New developments in hermetic packaging and sealing are now making faster, lighter, and smaller electronics possible.

Any technology that helps cram in more components without sacrificing functions is also welcome to handset manufacturers. Another technology front in the quest for greater miniaturization is the substrate-like printed circuit board, or SLP. It represents a cross between a flexible substrate and a rigid board.

The SLP shows up only in smartphones now, but it may be used in IoT devices and eventually AI applications, augmented and virtual reality devices, and automobiles. One of the big advantages is the flexibility of not having to choose between a PCB or substrates.

Substrate-like PCBsSubstrate-like PCBs were employed in assembling the iPhone 8 models and the iPhone X, according to Yole Développement, which describes the technology as “a clash of two worlds,” PCBs and substrates. SLP could prove to be an alternative to modified semi-additive processes, also known as mSAP, according to Yole.

“Advanced substrates must answer demands on both the scaling and functional roadmaps,” writes Emilie Jolivet, a technology and market analyst at Yole. “The transition from the subtractive to the mSAP process and from PCB to substrate-like PCB is under way in high-end smartphones, driven by Apple and its iPhone 8/iPhone X. Other high-end smartphone suppliers, such as Samsung and Huawei, are expected to join in the near future.”

SLP will have to contend with other technologies, namely package substrate vs. no substrate with fan-out platforms, along with through-silicon via packaging vs. TSV-less packaging.

Yole forecasts the SLP market will increase from $1.9 billion in 2016 to $2.24 billion by 2023.

“The 28 selected PCB/substrate manufacturers are all believed to have mSAP technology, and some of them can manufacture SLP,” said Yole’s Vivienne Hsu. “Driven by high-end smartphone demand, certain players appear to have high capital expenditures. Meanwhile, some large players show steady revenue in their PCB/substrate business.”

Seung Wook Yoon, director of group technology strategy for the JCET Group, the parent company of STATS ChipPAC, describes SLP as “a game changer for the industry.”

SLP could mean that outsourced semiconductor assembly and test (OSAT) customers won’t have to choose between PCBs or substrates for their products. He expects Samsung to follow Apple’s example.

Fan-out wafer-level packaging is for high-end application processors going into premium products, the flagship smartphone models for handset vendors, according to Yoon. SLP is meant for the motherboard of phones, reducing the space needed for such assemblies. Ball grid arrays or flip-chip packages are more typically used for fine-pitch slots in a phone, he noted. Wafer-level packages offer even finer pitches.

He likened SLP to chip-on-board packaging.

Printed circuit boards are progressing to the point where they can offer integration in addition to interconnection, according to Yole. Yoon echoed that observation. “This is mainly for the integration,” he says.

While the first noteworthy implementation of SLP is in mobile phones, such advanced semiconductor packaging could also find applications in 5G wireless communications, artificial intelligence, augmented and virtual reality, automotive electronics, and Internet of Things devices.

When it comes to advanced packaging, system-in-package technology and modules are other leading space-saving innovations, Yoon notes. “The cost may be higher,” he says.

He sees SLP possibly being used in IoT devices, in addition to mobile phones. Reducing the cost and the size remain the prime considerations.

Hermetic packaging and sealingHermetic packaging and sealing, meanwhile, is already ubiquitous. It is used in automotive electronics, aerospace and aviation systems, optical communication components and system for fiber-optic data telecommunications, sensor manufacturing, and other industrial applications. The airbag igniter in automobiles is one example of hermetic packaging.

“It’s hard to pinpoint just one overarching trend,” said Robert Hettler, head of R&D for optoelectronics at SCHOTT Electronic Packaging, a unit of SCHOTT North America and Germany’s SCHOTT AG. “However, there are a number of trends within various markets and applications.”

Higher precision is one of them. The world’s ever-growing hunger for data and faster transmission rates has increased demand for higher-performance chips.

“Faster chips need reliable, high-performance hermetically sealed packaging to achieve ever-faster data rates. The so-called ‘last mile’ to the customer, which covers fiber transmission lines to the home, would be unachievable without a new generation of high-performance, high-precision hermetic packages,” says Hettler. “SCHOTT recently introduced 50G hermetic transistor outline can packages, which can pave the way for much-needed bandwidth increases on datacom networks. 50G transistor outline (TO) technology will also enable faster data transmission to wireless cell towers, providing a technology that will be used to deploy 5G cellular networks, an improvement that will deliver speeds exponentially faster than current 4G infrastructure.”

He also cites the variety in materials used for hermetic packaging and sealing.

“On a material level, there has been an increase in demand for the use of non-magnetic materials, like titanium and niobium, which are interesting materials for a number of high-reliability applications. Glass-titanium compounds are especially well-suited for use in the areas of aviation, aerospace, oil and gas, and medical technology — if non-magnetic yet lightweight housings are needed. Alternatively, nickel-copper alloys are ideally suited for chemically aggressive environments due to its acid and alkali resistance,” Hettler says. “In medical electronics, the trend toward implantable devices is also leading to an increase in demand for the use of biocompatible materials like titanium and tantalum. Here, the development of highly reliable, yet more and more miniaturized hermetic packaging is of the essence. The development of glass-to-aluminum sealing technology now enables the manufacture of hermetic feedthroughs made with aluminum. This material is highly interesting for applications in which there is a need for lightweight materials or where aluminum is typically used for the casing, such as supercapacitors, electric double-layer capacitors, and lithium-ion batteries. Newly developed aluminum lid systems with hermetic glass-to-aluminum sealed feedthroughs support higher or longer-lasting performance of capacitors and batteries.”

Miniaturization in modern-day electronics is a priority, and hermetic packaging and sealing can address that need.

“Miniaturization in hermetic glass-to-metal and ceramic-to-metal sealed packages is a main point of focus,” he says. “Increasing application demands, particularly for smaller and smaller form-factor components, have made miniaturization a key topic in product innovation. A particularly relevant example can be found in the fiber-optic arena as TO packages for high-speed data transmission have been reduced in size for new, cutting-edge applications: in the development and transition from TO56 to TO38 packages, the footprint shrank by nearly 33%. Besides miniaturization of hermetic glass-to-metal and ceramic-to-metal packaging, full-ceramic multilayer housings and substrates experience increased interest. Multilayer ceramics support the growing trend towards miniaturization, cater for enhanced complexity requirements but also offer excellent thermal management properties: The multilayer design enables the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form-factor hermetic packages for both feedthroughs and multilayer ceramic circuit board substrates. Superior thermal conductivity of high-temperature co-fired ceramics and temperature resistance beyond 300 degrees Celsius (572 degrees F) make HTCC substrates a perfect fit for high-power applications.”

How is hermetic packaging and sealing being used today?

“The most popular uses for hermetic seals vary widely across many different areas,” Hettler says. “Some of the most notable uses include fiber optics and high-speed data transfer, automotive safety systems and other components, and pressure sensor feedthroughs and packaging applications. In the defense, aviation, and aerospace industries, hermetic housings and connectors are often used to protect reliability-critical control and instrumentation electronics.”

Microelectromechanical system devices are one area where hermetic packaging and sealing are required, not just a technology that’s good to have in certain applications.

“MEMS are sensitive and fragile components that are often placed in harsh environments, or in places in which replacement is expensive and inconvenient. Hermetic packaging and sealing provides reliable protection that can help prolongate the lifetime of these devices,” he says. “For example, SCHOTT HermeS glass wafer substrates with hermetically sealed solid metal through-glass vias enable miniaturized yet highly reliable and robust 3D wafer-level chip-scale packaging. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. The use of glass wafers in hermetic packaging has increased rapidly in recent years. The core reasons are the superior properties glass offers as a packaging material in particular, including its biocompatibility, the excellent transparency to radio frequencies and the transparency to visible light, which enables a wide range of optical applications. TGV technology enable long-term, reliable and extremely rugged packaging of industrial sensors, RF MEMS, and medical electronics.”

ConclusionAchieving ever-advancing miniaturization in microchips and electronics can call for a variety of new packaging technologies. Then again, tried-and-true approaches, such as hermetic packaging and sealing, can also fill the bill.


Global LAN/WAN Test Equipment Industry | killexams.com real questions and Pass4sure dumps

NEW YORK, Feb. 4, 2019 /PRNewswire/ -- This report analyzes the worldwide markets for LAN/WAN Test Equipment in US$ Thousand by the following Product Segments: Protocol Analyzers, Performance Analyzers & Stress Testers, and Conformance & Interoperability Test Systems.

Read the full report: https://www.reportlinker.com/p04484181

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World.

Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

The report profiles 52 companies including many key and niche players such as:- Anritsu Corporation- AOIP- Averna- EXFO Inc.- Fortive Corporation- Greenlee Textron, Inc.

Read the full report: https://www.reportlinker.com/p04484181

LAN/WAN TEST EQUIPMENT MCP-1MARKET ANALYSIS, TRENDS, AND FORECASTS, JANUARY 2CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting LimitationsDisclaimersData Interpretation & Reporting LevelQuantitative Techniques & AnalyticsProduct Definitions and Scope of StudyProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test Systems

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEWLAN/WAN Test Equipment Market: An Introductory PreludeNorthbound Trajectory in the Global ICT Sector Creates Conducive EnvironmentCSPs' Thrust Towards QoS & QoE Propagates Large-Scale OpportunitiesDeveloped Nations: Key Revenue ContributorsTable 1: Developed Regions Account for over 70% Share of the World LAN/WAN Test Equipment Market - Percentage Breakdown of Revenues for Developed and Developing Regions (2018E & 2022P) (includes corresponding Graph/Chart)Market Senses Huge Opportunities in Developing NationsTable 2: Global LAN/WAN Test Equipment Market - Geographic Regions Ranked by % CAGR for 2015-2022: Asia-Pacific (excluding Japan), Rest of World, Canada, Europe, US, and Japan (includes corresponding Graph/Chart)Assessing the Impact of Recent Economic Upheavals on LAN/WAN Test Equipment MarketStable Economic Scenario to Augment Market Demand in the Near- TermTable 3: World Real GDP Growth Rates in % (2016-2018P): Breakdown by Country/Region (includes corresponding Graph/Chart)Competitive LandscapeLeading Players in the Global LAN/WAN Test Equipment MarketVendors Prioritize M&A Route to Enhance Business OperationsSelect M&A Deals in the Global LAN/WAN Test Equipment Market (2014-2018)Pricing Scenario

2. KEY PRODUCT & APPLICATION MARKET TRENDSPerformance Analyzers & Stress Testers: The Key Product SegmentTable 4: World LAN/WAN Performance Analyzers & Stress Testers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Protocol Analyzers Continue to Generate RevenuesNoteworthy Trends in Protocol Analyzers SegmentBluetooth Protocol Analyzers Gather SeamPCIe Protocol Analyzers Assume ImportanceDOCSIS Protocol Analyzers Make a CutTable 5: World LAN/WAN Protocol Analyzers Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers, and Private Enterprises (includes corresponding Graph/Chart)Conformance & Interoperability Test Systems: Critical for Network EquipmentKey factors Responsible for Interoperability Issues: A SnapshotTable 6: World LAN/WAN Conformance & Interoperability Test Systems Market by End-User Segment (2017): Percentage Breakdown of Revenues for Communication Service Providers, Network Equipment Manufacturers and Private Enterprises (includes corresponding Graph/Chart)Test Equipment Gain Precedence in Network R&D, I&M & ProductionModular Test Equipment Make Their WayCloud-based SaaS Solutions Seek Role in LAN/WAN Testing SpaceProgression in Network Technologies: A Challenge to Test Equipment Vendors

3. KEY END-USE MARKET TRENDSEscalating Telecom & Datacom Traffic Volumes & Subsequently Rising Need to Augment Network Efficiency Builds Strong Business CaseTable 7: Global IP Traffic Volume in Exabytes (2014, 2016, 2018E & 2020P) (includes corresponding Graph/Chart)Table 8: Global IP Traffic Scenario by Region/Country (2017): Percentage Breakdown of Internet Data Consumption for North America, Japan, Europe, Asia-Pacific, Latin America, and Rest of World (includes corresponding Graph/Chart)Table 9: Global IP Traffic Scenario by Consumer Segment (2017): Percentage Breakdown of Internet Consumption for General and Business Consumers (includes corresponding Graph/Chart)Key Factors Influencing Telecom & Datacom Traffic GrowthSharp Increase in the Number of Internet SubscribersTable 10: Global Internet Usage by Geographic Region (2017): Percentage Breakdown of Number of Internet Users for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Table 11: Global Internet Usage by Geographic Region (2017): Penetration Rate of Internet (as a % of Total Population) for Africa, Asia-Pacific, Europe, Latin America, Middle East, and North America (includes corresponding Graph/Chart)Faster Broadband SpeedsSurging Investments on Advanced Telecom Infrastructure Extends Parallel OpportunitiesNetwork Test Equipment Assume Critical Importance in Wireless NetworksWi-Fi Roll Outs Bodes Well for Network Test Equipment Market GrowthContinued Evolution in IEEE 802.11 Standards Generates Parallel OpportunitiesWider Uptake of Smartphones Instigates Expansion in Wireless NetworksTable 12: Global Portable Devices Market by Device Type (2017 & 2020P): Percentage Breakdown of Unit Sales for Laptops, M2M Devices, Non-Smartphones, Smartphones, Tablets, and Others (includes corresponding Graph/Chart)Upcoming 5G Technology to Drive New Line of OpportunitiesExpanding Role of Fiber Optic Networks Offer OpportunitiesKey Trends Driving Growth in Fiber Optic Network DeploymentsSoaring Investments on EPON & GPON TechnologiesTests for Passive Optical Networks (PONs): A SnapshotProliferation of FTTx NetworksISPs Put Focus on Test Equipment Amid Soaring Demand for Gigabit Access ServicesNEMs Bet on Test Equipment in Equipment Design & DevelopmentTest Equipment for Seamless Deployment & Operation of Enterprise IT NetworksBusiness Continuity & Security Needs Propagate Demand for Enterprise-Grade Test EquipmentExpanding Image of Enterprise Mobility Creates Business CaseLAN/WAN Test Equipment Benefit from Sustained Demand for VoIPEmerging IoT to Widen the Scope & Span of Network Test EquipmentM2M Communication Networks Set to Instigate New Opportunities

4. PRODUCT OVERVIEWLocal Area Network (LAN)DefinitionFactors Differentiating Various LANsTopologyBus TopologyRing TopologyStar TopologyProtocolsMediaWide Area Network (WAN)LAN/WAN Test EquipmentProtocol AnalyzersPerformance Analyzers & Stress TestersConformance & Interoperability Test SystemsOther Testing Tools for LAN/WANCable TesterBit-Error Rate Tester (BERT)Personal Network AnalyzersPhysical Layer Tools for Testing LANCapacitance MeterNoise MeterPower MeterOhmmeterTime Domain ReflectometerHigh Frequency Signal GeneratorLine MapperTerminatorsMatching TerminatorShorting TerminatorEnhancements in LAN Testing CapabilitiesWireless LAN - An OverviewComparing 802.11ad, 802.11af and 802.11ah ProtocolsGrowth Drivers for WLAN MarketPros and Cons

5. PRODUCT INTRODUCTIONS/INNOVATIONSTektronix Rolls Out 59 GHz DPO7OE2 Single Mode Optical ProbeIDEAL Networks Releases Software Updates for SignalTEK CT and SignalTEK NT TestersSpirent Communications Develops World's Highest Density 400/ 200/100/50GbE Test SystemTeledyne LeCroy Expands Link Layer Compliance Tests PortfolioVeEX Introduces RXT-6200 Universal 100G Test Module for RXT- 1200 PlatformVIAVI Solutions Upgrades Cable Signal Meters with Trilithic' Leak Detection TechnologyEXFO Rolls Out SkyRAN Proactive Test & Monitoring Solution for RF Interference & Fronthaul NetworksAnritsu Unveils Radio Communication Test Station MT8000A PlatformNational Instruments Develops LabView NXG 1.0Netscout Systems Unveils LinkRunner™ G2 Android-based Smart Network TesterVIAVI Solutions Rolls Out FiberChek SidewinderViavi Solutions Introduces Xgig 4K16 Protocol Analyzer/Jammer for PCI Express 4.0 TechnologySaelig Unveils USB-Powered Bluetooth Protocol AnalyzerKeysight Technologies Launches Industry's First 5G Protocol Test SolutionTeledyne LeCroy Launches LinkExpert Software Interface for its PCIe Protocol AnalyzersTeledyne LeCroy Introduces Eclipse M32 UniPro/ UFS Protocol Analyzer/ExerciserSpirent Communications Rolls Out World's First 200G Ethernet Test SystemFuturePlus Systems Introduces industry's First HBRDisplayPort Protocol Analysis ToolEXFO Releases FTBx-88400NGE Power Blazer 400G Testing SolutionAnritsu Develops ME7800L Conformance Test SystemSpirent Unveils First Automotive Ethernet Protocol Conformance & Performance Test System with 1000BASE-T1 Physical Layer StandardIntrospect Technology Enhances SV3C Personal SerDes Tester with DSLineeye Releases LE-3500R & LE-2500R Multi-Protocol AnalyzersAnritsu Rolls Out CPRI RF Module for Network Master Pro™ MT1000A TesterIxia Rolls Out TrafficREWIND™Teledyne LeCroy Unveils T416 PCIe AnalyzerTeledyne LeCroy Rolls Out Sodera LE AnalyzerSpirent Introduces Spirent Vertex Channel Emulator for Wireless RF TestingSpirent Unveils Spirent TestCenter WLAN Test PlatformSpirent Expands Elevate™ Test Framework & Prolab™ Test Suite for EVS Codec TestingSpirent Launches Spirent TemevaSpirent Introduces Spirent Landslide™ C100-M2 Test PlatformSpirent Launches CyberFlood™ Security & Performance Testing SolutionAnritsu Introduces OTDR Module for Network Master™ Pro MT1000A TesterGL Communications Unveils PacketExpert 10G Ethernet/IP TesterGreenlee® Introduces AirScout™ Wi-Fi Readiness Test SolutionIDEAL Networks Launches LanTEK® II Cable CertifierFrontline Rolls Out ComProbe Sodera Wideband Bluetooth Protocol AnalyzerSpirent Rolls Out 50GbE Boost Ethernet Test SolutionTeledyne LeCroy Introduces Voyager M310C USB Protocol Analyzer and Exerciser SystemSpirent Unveils DX2-100GbE QSFP28 and CFP4 8-Port ModulesIxia unveils 25GbE Validation SolutionAnritsu Receives LTE 3CA PTCRB Certification for ME7873LA LTE- Advanced RF Conformance Test SystemAnritsu Unveils Remote Spectrum Monitor

6. RECENT INDUSTRY ACTIVITYoneM2M Selects Spirent's Compliance Testing ToolsTeledyne LeCroy Receives Bluetooth SIG's Validation for Harmony LE TesterViavi Solutions Acquires Cobham's AvComm and Wireless T&M BusinessesNI to Collaborate with Samsung to Develop 5G Test UEs for 5G NRRiverbed Launches Riverbed Rise Channel Partner ProgramEXFO Partners with KontronEXFO Acquires Majority Stake in AstelliaSpirent Communications Announces Spirent Pace Global Partner ProgramEXFO Teams Up with ADVAEXFO Collaborates with China Mobile for IoT Network TestingHuawei Endorses Anritsu's MT8870A Test Platform for RF Calibration & Validation TestsSamsung Selects Anritsu's Signal Analyzer MS2850A for 5G System DevelopmentsNational Instruments Acquires AWRFluke Networks Snaps Up ClearSight NetworksKeysight Technologies Acquires IxiaEXFO Acquires Yenista OpticsAnritsu Inks Distribution Agreement with Comtec Cable AccessoriesIDEAL Networks Opens New Office in ShanghaiIDEAL Networks Launches New Office in MelbourneTeledyne Lecroy Acquires Quantum DataAnritsu Acquires Azimuth SystemsNoviFlow Teams Up with IxiaArrow Electronics Inks Distribution Agreement with IxiaIxia Joins New IP Agency (NIA)QualiTest Joins Ixia's Global Solution Provider ProgramTeledyne Technologies Acquires Frontline Test EquipmentSpirent Acquires Testing TechnologiesT-Mobile Netherlands Selects Anritsu's MasterClaw™ Service Assurance SystemChina Unicom Teams Up with Spirent to Test Virtualization MiddlewareVector Informatik Collaborates with IxiaSpirent Takes Over EpitiroSimplay™ Labs Receives Evaluation Approval for SL-8Miracast HDCP 2.2 Test Tool from DCPTeledyne LeCroy Extends Capabilities of PCI Protocol Analyzer Product FamilyIntel Selects Averna's DP-1000 DOCSIS Protocol AnalyzerFortinet Collaborates with Spirent to Validate FortiGate®- 3810D Firewall ApplianceSGS Deploys Spirent 8100 LTE Solution to Enhance Critical Test CapabilitiesViavi Solutions Establishes Lumentum

7. FOCUS ON SELECT GLOBAL PLAYERSAnritsu Corporation (Japan)AOIP (France)Averna (Canada)EXFO, Inc. (Canada)Fortive Corporation (USA)Fluke Corporation (USA)Tektronix, Inc. (USA)Greenlee Textron, Inc. (USA)IDEAL INDUSTRIES, INC. (USA)Keysight Technologies, Inc. (USA)Ixia (USA)National Instruments Corporation (USA)NetScout Systems, Inc. (USA)Riverbed Technology, Inc. (USA)Rohde & Schwarz (Germany)Spirent Communications plc (UK)Teledyne LeCroy (USA)VeEX, Inc. (USA)Digital Lightwave (USA)Viavi Solutions, Inc. (USA)Wilcom Inc. (USA)

8. GLOBAL MARKET PERSPECTIVETable 13: World Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 14: World Historic Analysis for LAN/WAN Test Equipment by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 15: World 14-Year Perspective for LAN/WAN Test Equipment by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)Analytics by Product SegmentTable 16: World Recent Past, Current & Future Analysis for Protocol Analyzers (PA) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 17: World Historic Analysis for Protocol Analyzers (PA) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 18: World 14-Year Perspective for Protocol Analyzers (PA) by Region/Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)Table 19: World Recent Past, Current & Future Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 20: World Historic Analysis for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 21: World 14-Year Perspective for Performance Analyzers & Stress Testers (PA&ST) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)Table 22: World Recent Past, Current & Future Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 23: World Historic Analysis for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2(includes corresponding Graph/Chart)Table 24: World 14-Year Perspective for Conformance and Interoperability Test Systems (C&ITS) by Region/ Country - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for the Years 2009, 2018 & 2022 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATESA.Market AnalysisThe Prime Market for LAN/WAN Test EquipmentTable 25: US Accounts for Over 2/5th Share of the World LAN/WAN Test Equipment Market - Percentage Breakdown of Revenues for US and Rest of World (2018E & 2022P) (includes corresponding Graph/Chart)Performance Analyzers & Stress Testers - Order of the DayProtocol Analyzers - A Key Product CategoryMarket Witnesses Shift from Conventional Protocol AnalyzersConformance & Interoperability Test Systems - Witnessing Buoyant GrowthCompetitive ScenarioImpact of 2007-2009 Economic Recession in RetrospectProduct LaunchesStrategic Corporate DevelopmentsSelect Key PlayersB.Market AnalyticsTable 26: US Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 27: US Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 28: US 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

2. CANADAA.Market AnalysisRobust Investments on Wi-Fi & Mobile Network Deployments Generate OpportunitiesProduct LaunchesCorporate DevelopmentSelect Key PlayersB.Market AnalyticsTable 29: Canadian Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 30: Canadian Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 31: Canadian 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

3. JAPANA.Market AnalysisProduct LaunchesKey PlayerB.Market AnalyticsTable 32: Japanese Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 33: Japanese Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 34: Japanese 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

4. EUROPEA.Market AnalysisA Mature MarketIncreasing Deployment of Wireless Networks Bolster Market GrowthContinued Investments on LTE Networks Drives Wireless Test Equipment MarketStrategic Corporate DevelopmentsProduct LaunchSelect Key PlayersB.Market AnalyticsTable 35: European Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2022 (includes corresponding Graph/Chart)Table 36: European Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 37: European 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

5. ASIA-PACIFICA.Market AnalysisHigh-Potential Opportunities Prevail in the Asia-Pacific RegionAdvancements in Communication Infrastructure Drive DemandRapidly Growing Outdoor Wi-Fi Deployments Bode WellCompetition Set to IntensifyWireless Test Equipment Market in China: An OverviewGrowing Outdoor Wi-Fi Roll OutsWireless Test Equipment Market in IndiaOutdoor Wi-Fi Gathers SteamProduct LaunchStrategic Corporate DevelopmentsB.Market AnalyticsTable 38: Asia-Pacific Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2(includes corresponding Graph/Chart)Table 39: Asia-Pacific Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 40: Asia-Pacific 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

6. REST OF WORLDMarket AnalysisTable 41: Rest of World Recent Past, Current & Future Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2015 through 2(includes corresponding Graph/Chart)Table 42: Rest of World Historic Analysis for LAN/WAN Test Equipment by Product Segment - Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets Independently Analyzed with Annual Revenues in US$ Thousand for the Years 2009 through 2014 (includes corresponding Graph/Chart)Table 43: Rest of World 14-Year Perspective for LAN/WAN Test Equipment by Product Segment - Percentage Breakdown of Revenues for Protocol Analyzers (PA), Performance Analyzers & Stress Testers (PA&ST), and Conformance & Interoperability Test Systems (C&ITS) Markets for the Years 2009, 2018 & 2(includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 52 (including Divisions/Subsidiaries - 60) The United States (30) Canada (6) Japan (3) Europe (11) - France (2) - Germany (2) - The United Kingdom (4) - Rest of Europe (3) Asia-Pacific (Excluding Japan) (10)Read the full report: https://www.reportlinker.com/p04484181

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__________________________Contact Clare: clare@reportlinker.comUS: (339)-368-6001Intl: +1 339-368-6001

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Molex Receives 2008 Best Technical Support Award from Huawei Technologies | killexams.com real questions and Pass4sure dumps

Huawei cites Molex's outstanding customer relationship management in support of Huawei's R&D team as key to win

LISLE, Ill. June 24, 2009 - Molex Incorporated (NASDAQ: MOLX and MOLXA) was awarded the 2008 "Best Technical Support" award by Huawei Technologies Co. Ltd., a leader in providing next generation telecommunications network solutions for operators around the world. The award recognizes Molex's continued assistance to and support of Huawei's R&D team in providing timely and professional technical advice and strong sales and customer service for Huawei's new product design.

"We're honored to have received the "Best Technical Support" award from Huawei," said Frank Tan, VP of APS sales and marketing, Molex Incorporated. "Molex worked closely with the Huawei R&D team to ensure prompt technical support and fast issue resolution."

In recognizing Molex, Huawei executives noted that the company's excellent customer relationship management has led to a very high level of trust in Molex's technical capabilities to provide leading datacom solutions. Said Zheng Yi, vice director of CEG, Huawei: "The Molex team even organized an audit trip for the Huawei team to

Molex's Little Rock connector factory to help us better understand the company's manufacturing processes."Molex is the only connector supplier to win this award from Huawei. Most recently, Huawei chose the Molex ImpactTM 6-pair standard backplane and daughtercard connectors.

For more information, please visit www.molex.com.

About Molex Incorporated

Molex Incorporated is a 70-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com.

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